Industry News: definition of mbb (Page 1 of 7)

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2015

Industry News | 2015-01-21 21:05:20.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2016

Industry News | 2016-02-17 17:07:17.0

“The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1334 at the 2016 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place March 15-17, 2016 at the Las Vegas Convention Center.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

Industry News | 2017-01-11 18:22:38.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2020

Industry News | 2020-01-06 16:06:59.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.

MIRTEC Corp

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

Newly Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering

Industry News | 2012-03-21 17:42:19.0

For many designers and manufacturing personnel in the electronics manufacturing supply chain, IPC-AJ-820, Assembly and Joining Handbook, is the document of choice for all aspects involved in creating a PCB.

Association Connecting Electronics Industries (IPC)

IPC-2540 CAMX Standard Series Provides Easy Flow of Information.

Industry News | 2001-01-24 07:49:08.0

IPC has announced the circulation of the final interim ballot for IPC-2540, CAMX Shop Floor Equipment Communications standard series. After a final ballot has been tabulated and approved, the standard is made available in 30 days.

Association Connecting Electronics Industries (IPC)

IPC Offers Electronics Industry Summary of Final SEC Conflict Minerals Regulation Hundreds of pages simplified into easy-to-understand document

Industry News | 2012-09-11 19:10:13.0

. To help electronics manufacturers and their suppliers make sense of the rule, IPC – Association Connecting Electronics Industries® has developed, “Summary of the Final SEC Rules on Conflict Minerals,” a 7-page document that is downloadable as a PDF file.

Association Connecting Electronics Industries (IPC)

IPC and SMTA Announce Chairs for Workshop 2 of the High Performance Cleaning and Coating Conference

Industry News | 2010-10-04 17:26:28.0

Industry-leading associations IPC and SMTA jointly announce the chairs of Workshop 2 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Surface Mount Technology Association (SMTA)

IPC Joins NextFlex Standards development key focus of IPC involvement in flexible hybrid manufacturing institute

Industry News | 2016-02-25 14:36:24.0

IPC — Association Connecting Electronics Industries® has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, Calif. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.

Association Connecting Electronics Industries (IPC)

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