Electronics Forum: definition of ultra fine pitch component (Page 1 of 5)

ultra low cost pick and place?

Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap

I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy

Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc

Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't

Help me find Manufacturer of XRAY Machine

Electronics Forum | Tue Dec 27 10:11:50 EST 2005 | pjc

Here's a few mfrs. to look at. http://www.vjelectronix.com/vjebeta/index.asp http://www.glenbrooktech.com/advantage.htm http://www.lixi.com/product_workstation.htm http://www.focalspot.com/ http://www.microfocus-x-ray.com/frameset.php?PageN

Re: Placement of 0201'

Electronics Forum | Mon Aug 03 20:10:52 EDT 1998 | Dave Kalen

| | | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment

measument of paste thickness after Screen Printing

Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob

Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut

Push&Pull Test of Fine Pitch Components

Electronics Forum | Fri Sep 19 14:11:39 EDT 2003 | Bryan Sheh

Dear all, Is there anyone who has the experience in conducting Push&Pull test for fine pitch components?i.e.SOIC,QFP. The customer clearly stated that,"every lead should be tested for selected components".but, you know that,the fine pitch,0.5 or

Wetting problem of PCB after reflow soldering

Electronics Forum | Fri Sep 14 15:31:02 EDT 2001 | davef

How in earthly heaven would someone else have a report analyzing the defects on your boards? Among the good failure analysis labs that can assess situations like yours are: * Robisan Laboratory 6502 East 21 St Indianapolis, IN 46219 317-353-6249 fax

Wetting problem of PCB after reflow soldering

Electronics Forum | Fri Sep 14 02:18:32 EDT 2001 | gsparka

Hi. After reflow soldering. There are lots of non wetting of leads. 71 b'd all are mounted resister,condensor,qfp,plcc,bga have got the defects so many. all defecs occured in the fine pitch ic. others are good. On some fine pitch pads not mou

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