Industry News: definition of ultra fine pitch component (Page 1 of 11)

What's happening at MIRTEC in 2008?

Industry News | 2008-03-25 23:53:54.0

Comment from Brian D�Amico, President

MIRTEC Corp

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

International Conference on Soldering and Reliability (ICSR) Best of Conference Announced

Industry News | 2013-06-26 09:09:19.0

The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.

Surface Mount Technology Association (SMTA)

Join OK International at Enova Grand Ouest in France for a Demonstration of Metcal’s New MX-5200

Industry News | 2013-02-27 15:04:56.0

February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.

Association Connecting Electronics Industries (IPC)

IPC Announces Results of the IPC Rework Experience Competition at SMT Hybrid Packaging International Exhibition and Conference 2016

Industry News | 2016-06-15 20:20:37.0

The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.

Association Connecting Electronics Industries (IPC)

Call For Papers Issued For IPC Annual Meeting Technical Conference

Industry News | 2001-02-27 22:31:53.0

IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.

Association Connecting Electronics Industries (IPC)

Count On Tools Introduces MYDATA Midas Nozzles

Industry News | 2010-05-03 20:04:18.0

GAINESVILLE, GA ― Count On Toos Inc., a leading provider of precision components and SMT spare parts, introducing its new MYDATA Midas replacement nozzles and consumables.

Count On Tools, Inc.

DEK launches new stencil solution for ultra fine-pitch printing

Industry News | 2009-03-02 00:28:54.0

DEK has announced the launch of its VectorGuard� Platinum stencil technology. Now available for DEK customers in Asia, Europe and the Americas, the new technology provides semiconductor manufacturers with an ideal solution for a diverse range of next-generation challenges.

ASM Assembly Systems (DEK)

ESSEMTEC to Highlight Range of Equipment at APEX 2010

Industry News | 2010-03-24 13:19:39.0

Glassboro, NJ — Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will feature a range of new equipment in booth 1059 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

ESSEMTEC AG

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