New SMT Equipment: deflected (65)

MPM Momentum II 100 Stencil Printer

MPM Momentum II 100 Stencil Printer

New Equipment | Printing

A value-priced high-performance printing solution designed to meet the demands of high-volume production The Momentum® II 100 stencil printer is a hard-working, value-priced machine utilizing the robust, reliable Momentum series p

ITW EAE

Siemens DEFLECTION UNIT X 00330938

Siemens DEFLECTION UNIT X 00330938

New Equipment | Other

Siemens DEFLECTION UNIT X 00330938 Siemens DEFLECTION UNIT X 00330938 SMT Spare Parts Siemens Spare Parts Delivery time: 1-3 days Product description: Siemens DEFLECTION UNIT X 00330938  INQUIRY Siemens DEFLECTION UNIT X 00330938 Spe

Fomyn Equipment co,.ltd

Electronics Forum: deflected (64)

pcb board deflection when mounting component

Electronics Forum | Sun Oct 27 07:56:58 EST 2002 | wongmanchung

Does any expert here know the specification of board deflection when we mounting component by pick and place machine? That is when the nozzle place the chip on the pcb, the board will have some deflection. And are there any requirment that we need t

PCB/PCBA deflection standard

Electronics Forum | Mon Jan 31 20:07:29 EST 2022 | emeto

Thank you both, it is not the good HLA design and this is why the deflection is needed to sit everything properly in the case. We did ask cust0mer(we are CM) to change it, I am just looking for a standard to support our claim.

Industry News: deflected (24)

IPC and SMTA Announce the Session 1 Agenda for the High Performance Cleaning and Coating Conference

Industry News | 2010-09-20 19:36:19.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Surface Mount Technology Association (SMTA)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: deflected (97)

Technical Library: deflected (2)

Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards

Technical Library | 2021-09-15 18:58:01.0

Mathematical model for dynamic force analysis of printed circuit boards has been designed to calculate dynamic deformations and stresses in printed circuit boards and assess their dynamic strength and rigidity. The represented model describes a printed circuit board as a separate oscillatory system, which is simulated as prismatic beam set on two oscillating supports. Simulation and assessment of stress and deflection in printed circuit boards and obtaining their amplitude frequency responses provided recommendations, which ensure strength and stiffness of printed circuit boards subjected to dynamic loads..

Khmelnytsky National University

Simulation of Droplet Jetting of a Non-Newtonian Mixed Suspension

Technical Library | 2021-06-15 18:40:53.0

The jet printing of a dense mixed non-Newtonian suspension is based on the rapid displacement of fluid through a nozzle, the forming of a droplet and eventually the break-off of the filament. The ability to model this process would facilitate the development of future jetting devices. The purpose of this study is to propose a novel simulation framework and to show that it captures the main effects such as droplet shape, volume and speed. In the framework, the time dependent flow and the fluid-structure interaction between the suspension, the moving piston and the deflection of the jetting head is simulated. The system is modelled as a two phase system with the surrounding air being one phase and the dense suspension the other. Hence, the non-Newtonian suspension is modelled as a mixed single phase with properties determined from material testing. The simulations were performed with two coupled in-house solvers developed at Fraunhofer-Chalmers Centre; IBOFlow, a multiphase flow solver and LaStFEM, a large strain FEM solver. Jetting behaviour was shown to be affected not only by piston motion and fluid rheology, but also by the energy loss in the jetting head. The simulation results were compared to experimental data obtained from an industrial jetting head.

Fraunhofer-Chalmers Research Centre for Industustrial Mathematics

Videos: deflected (13)

Siemens Ceram Pads 00359505-01

Videos

00365776-01 Limit Switch Width Adjustment 2 00365777-01 Limit Switch  Mounting Tub 00366104-01 TR-GREASE NIPPLE 00366174-01 CARTOUCHE FOR GREASE 00366229-01 RETROFIT KIT CAL.. f. S25HM2/HS55/HF 00366391-01 STOPPER PCB ADJUSTMENT 00366392-01 Sto

Qinyi Electronics Co.,Ltd

Siemens Cable 0305394

Videos

00359433-01 Reflection Light Barrier, configured 00359434-01 Crash Light Barrier,configured 00359435-01 Neutral Position Light Barrier 00359436-01 Unlock Device WTC 00359438-01 Connection Cable: Power MTC 00359459-01 LIFTING TABLE SINGLE CONVEYO

Qinyi Electronics Co.,Ltd

Express Newsletter: deflected (3)


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