New SMT Equipment: dek 2,0 (20)

DEK Galaxy - Screen Printer

DEK Galaxy - Screen Printer

New Equipment | Printing

Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno

ASM Assembly Systems (DEK)

Moore ,Siemens	A5E00282005/09

Moore ,Siemens A5E00282005/09

New Equipment | Industrial Automation

A5E00282005/09  ACM+ Advanced Control Module Manufacturers Moore, Siemens Model(s) Moore APACS, Moore APACS Control and Computer Modules Additional Information ROM 4.0 Estimated Shipping Size   Dimensions: 2.0"

Askplc Limited

Electronics Forum: dek 2,0 (5)

Cpk Variables Control for Paste Printing

Electronics Forum | Thu Apr 04 16:38:51 EST 2002 | davef

Equipment companies like to talk about �accuracy� and �repeatability�. These measures provide limited information. Flaws of the measure aside, some printer companies have begun to report Cp. * DEK ELA: Cp = 1.33 @ �0.025mm * DEK 265: Cp = 1.6 @ �0.0

DEK 265gsx vision calibration

Electronics Forum | Fri Mar 26 23:07:07 EDT 2010 | dekhead

Just a guess: Are you printing your fiducials on the fiducial side of the board? Fidicial Side is for Vision Calibration, Bare Copper Side is for Offset Calibration (Step 5 of procedure says "copper side uppermost"). After printing 25 fiducials o

Used SMT Equipment: dek 2,0 (2)

DEK Horizon Screen Printer

DEK Horizon Screen Printer

Used SMT Equipment | Screen Printers

Pressure Feedback, closed loop control Print Gap: 0 - 6mm Stencil Separation Speed: 0.1 - 20mm/sec Distance: 0 - 3mm Print Modes: ProFlow, Print Print, Print Flood, Flood Print, Adhesive Paste Knead: Programmable: Number, Period,

Capital Equipment Exchange

Fuji CP-4.2

Fuji CP-4.2

Used SMT Equipment | Chipshooters / Chip Mounters

Fuji CP-4.2 has 9,500 hours, and SMD 2 vision Will come with 100 various size feeders and A feeder Cart! Machines are sold "As is, where is" Firmware: SMD2 Comes with: DEK 265 GS IP-2 with tower (both have a bad card and are non-working)

Electronic Source Company

Industry News: dek 2,0 (11)

DEK Gives APEX Attendees Look at Future-Proofed Technologies

Industry News | 2009-03-17 04:47:26.0

From DEK booth #2412 at this year's APEX event, being held over March 31 � April 2 in Las Vegas, Nevada, visitors will witness the ultimate in product versatility and choice for a truly future-proofed investment and productivity advantage.

ASM Assembly Systems (DEK)

DEK Set for Major Debut at Electronics Midwest and SMTA International

Industry News | 2010-09-15 20:20:22.0

From Chicago, Illinois over September 28 – 30 and Orlando, Florida on October 26 and 27, DEK plans to showcase its powerful Horizon 03iX print platform and also introduce visitors to a breakthrough technology that is set to significantly extend process latitude and enhance productivity. Show attendees and customers in the Midwest and Southeast regions will be among the first to see this advance in person.

ASM Assembly Systems (DEK)

Parts & Supplies: dek 2,0 (136)

Yamaha AS-A24-1152-B FTA-A24-1152-B KW1-M459D-000 CL24MM Feida Accessories

Yamaha AS-A24-1152-B FTA-A24-1152-B KW1-M459D-000 CL24MM Feida Accessories

Parts & Supplies | Assembly Accessories

Supply SMT placement machine FUJI Fuji CP6 CP7 Feida accessories KJAC0560 KJAC0561 Supply applicable SMT placement machine FUJI Fuji Feida accessories NXT8MM Feida button PB03FF1 Supply placement machine NXT XPF accessories CHIP 3216 small white ma

KingFei SMT Tech

Samsung KW-F8-259 20mm fixed camera

Samsung KW-F8-259 20mm fixed camera

Parts & Supplies | Assembly Accessories

Samsung NEO Security Gate Samsung CP40 AC servo motor / motor 920B10100DXSOJ 1.0 KW200V 6.9 A Samsung CP40Y shaft connection gear 0133631002 Samsung CP40Y shaft connection bearing 6009ZZ Samsung CP 40X shaft connection bearing Samsung CP 40X axl

KingFei SMT Tech

Technical Library: dek 2,0 (5)

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Technical Library | 2007-12-13 17:03:02.0

Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.

ASM Assembly Systems (DEK)

Screen and Stencil Printing Processes for Wafer Backside Coating

Technical Library | 2009-09-09 15:08:19.0

Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.

ASM Assembly Systems (DEK)

Career Center - Resumes: dek 2,0 (2)

SMT programming

Career Center | garaden grove, California USA | Engineering,Management,Production,Quality Control,Technical Support

11 years experience in SMT process.

Quality assurance

Career Center | Bhiwadi, India | Quality Control

TS 16949:2009 certified internal auditor from bsi. Training on ISO QMS 9001:2008. Training on IPC-A-610 standard Training on visual management, Kaizen & 5 S’’ Well versed about 5S, 8D, 7QC tools, 4M, 3R, 4R, kaizen, kanban, poka yoke, PPAP, SPC, ECN,

Express Newsletter: dek 2,0 (337)

dek 2,0 searches for Companies, Equipment, Machines, Suppliers & Information

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Selective Conformal Coating System

MSD Dry Cabinets
Used SMT Equipment Auction Spartronics

Repair tools for all your electronic circuit board repair needs.
Solder Mask & Low Stand-off Component Cleaning

Easily dispense fine pitch components with ±25µm positioning accuracy.
Best SMT Reflow Oven

Real Time Process Control BREAKTHROUGH for Dispensing Industry.
Cable Assembly and Wire Harness Manufacturing Flux Connectivity

Low-cost, self-paced, online training on electronics manufacturing fundamentals