Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
Electronics Forum | Thu Apr 04 16:38:51 EST 2002 | davef
Equipment companies like to talk about �accuracy� and �repeatability�. These measures provide limited information. Flaws of the measure aside, some printer companies have begun to report Cp. * DEK ELA: Cp = 1.33 @ �0.025mm * DEK 265: Cp = 1.6 @ �0.0
Electronics Forum | Fri Mar 26 23:07:07 EDT 2010 | dekhead
Just a guess: Are you printing your fiducials on the fiducial side of the board? Fidicial Side is for Vision Calibration, Bare Copper Side is for Offset Calibration (Step 5 of procedure says "copper side uppermost"). After printing 25 fiducials o
Pressure Feedback, closed loop control Print Gap: 0 - 6mm Stencil Separation Speed: 0.1 - 20mm/sec Distance: 0 - 3mm Print Modes: ProFlow, Print Print, Print Flood, Flood Print, Adhesive Paste Knead: Programmable: Number, Period,
Fuji CP-4.2 has 9,500 hours, and SMD 2 vision Will come with 100 various size feeders and A feeder Cart! Machines are sold "As is, where is" Firmware: SMD2 Comes with: DEK 265 GS IP-2 with tower (both have a bad card and are non-working)
Industry News | 2009-03-17 04:47:26.0
From DEK booth #2412 at this year's APEX event, being held over March 31 � April 2 in Las Vegas, Nevada, visitors will witness the ultimate in product versatility and choice for a truly future-proofed investment and productivity advantage.
Industry News | 2010-09-15 20:20:22.0
From Chicago, Illinois over September 28 – 30 and Orlando, Florida on October 26 and 27, DEK plans to showcase its powerful Horizon 03iX print platform and also introduce visitors to a breakthrough technology that is set to significantly extend process latitude and enhance productivity. Show attendees and customers in the Midwest and Southeast regions will be among the first to see this advance in person.
Supply SMT placement machine FUJI Fuji CP6 CP7 Feida accessories KJAC0560 KJAC0561 Supply applicable SMT placement machine FUJI Fuji Feida accessories NXT8MM Feida button PB03FF1 Supply placement machine NXT XPF accessories CHIP 3216 small white ma
Samsung NEO Security Gate Samsung CP40 AC servo motor / motor 920B10100DXSOJ 1.0 KW200V 6.9 A Samsung CP40Y shaft connection gear 0133631002 Samsung CP40Y shaft connection bearing 6009ZZ Samsung CP 40X shaft connection bearing Samsung CP 40X axl
Technical Library | 2007-12-13 17:03:02.0
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.
Technical Library | 2009-09-09 15:08:19.0
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers.
Career Center | Bhiwadi, India | Quality Control
TS 16949:2009 certified internal auditor from bsi. Training on ISO QMS 9001:2008. Training on IPC-A-610 standard Training on visual management, Kaizen & 5 S’’ Well versed about 5S, 8D, 7QC tools, 4M, 3R, 4R, kaizen, kanban, poka yoke, PPAP, SPC, ECN,