New SMT Equipment: delamination, .25 oz copper foil (9)

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Electronics Forum: delamination, .25 oz copper foil (9)

2 oz Copper thickness??

Electronics Forum | Tue Apr 23 15:18:02 EDT 2013 | davef

2 oz copper should be 2 oz per ft^2 thick. There is no relationship between thickness and copper weight due to the effect of processing. Since this is a painful way of thinking about things, ppl have reached a compromise and talk about 'nominal thick

Copper Finishes versus Layer Thickness

Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House

Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y

Industry News: delamination, .25 oz copper foil (2)

Isola Introduces Ultra-Low Loss Materials for 100 Gigabit Ethernet Applications

Industry News | 2014-06-26 20:12:53.0

Isola Group announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 Gigabit Ethernet (100GbE) at data rates in excess of 25 Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis coefficient of thermal expansion (CTE) on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.

Isola Group

7 Common PCB Design Mistakes

Industry News | 2019-11-05 22:05:41.0

The printed circuit board, or PCB, is responsible for connecting all the components with each other in your electronic assembly. Making just one tiny error in the design could lead to complete failure. PCB layout design requires ardent precision and great technological skills.


Technical Library: delamination, .25 oz copper foil (16)

A Designed Experiment for the Influence of Copper Foils on Impedance, DC Line Resistance and Insertion Loss

Technical Library | 2013-03-28 16:18:22.0

For the last couple of years, the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently, the need to reduce insertion loss came up in discussions with blank board customers (...) The paper describes the test vehicle and the testing methodology and discusses in detail the electrical performance characteristics. The influence of the independent variables on the performance characteristics is presented. Finally the thermal reliability of the boards built applying different copper foils and oxide replacements was investigated.

Multek Inc.

High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project

Technical Library | 2019-02-06 22:02:08.0

The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods, with a focus on the methods used for speeds above 2 GHz. A comparison of test methods from 1 to 2 GHz through to higher test frequencies was desired, testing a variety of laminate materials (standard volume production with UL approval, low loss, and "halogen-free" laminate materials). Variations in the test board material resin content/construction and copper foil surface roughness/type were minimized. Problems with Dk/Df and loss test methods and discrepancies in results are identified, as well as possible correlations or relationships among these higher speed test methods.

Oracle Corporation

Express Newsletter: delamination, .25 oz copper foil (136)

SMTnet Express - August 16, 2018

SMTnet Express, August 16, 2018, Subscribers: 31,259, Companies: 11,015, Users: 25,092 Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi; JX

Partner Websites: delamination, .25 oz copper foil (2)

The Branford Group - Recent Auctions


: Date Alphabetical Stant Manufacturing, Inc.    [Online] SOLD - Auction Closed on 7/28/2021 Major Automotive Parts Mfr. & Distribution Center (25) Injection Molders

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