Industry Directory | Manufacturer
Manufacture high-density memory and processor-based products, displays, interfaces
Industry Directory | Manufacturer
supplier of low expansion, highly conductive, light-weight, machinable metallic alloys for thermal m
JUKI JX-300 LED SMT Chip Mounter Machine Improvements in Productivity Outstanding Area Productivity Mounting Quality that Supports High Density Mounting Model Interchangeability Model FX-3 FX-1R(Conventional model kind) P
New Equipment | Coating Equipment
HMH-830 PCBA coating machine PCBA coating system X, Y, Z, three-axis motion, accurately realize the selective spraying process of various circuit boads to avoid non-coated areas such as connectors. 1.Accurately realize selective spraying of various
Electronics Forum | Wed Sep 29 17:36:02 EDT 1999 | Earl Moon
We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control and
Electronics Forum | Tue Jan 31 11:56:12 EST 2006 | kmorris
Just wanted to take a quick poll, as to how others are taking flux density measurements on their wave solder machines.(those that don't have flux density contollers) We are using a glass hydrometer, but I see there is a digital model on the market.
Used SMT Equipment | In-Circuit Testers
2) Controller(s) B180L & RP5700 ** includes switch boxes and cables ** (2) ASRU C Cards (2) Control Xt Cards (18) Hybrid Double Density Pin Cards (2) 6624 Power Supplies (1) Printer Condition: Complete & Operational “Passes Diagnostics”
Used SMT Equipment | In-Circuit Testers
• [1] Windows Controller • [2] ASRU C Cards • [2] Control XTp Cards • [18] Hybrid 6Mp/s Double Density Cards • [2] 6624A Power Supplies
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Parts & Supplies | In-Circuit Testers
Keysight / Agilent Part Number E4000-6X550 Hybrid Double Density 6mps Pin Card $3950 OBO
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
QXJ-NC32 SMT pick and place nozzle cleaning machine In the field of the semiconductor industry today, with the development of SMT, small parts into small, high-density mounting and base for reality, and future development trends will be further co
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Tue Mar 26 00:00:00 EDT 2024 - Tue Mar 26 00:00:00 EDT 2024 | Peoria,
Ultra High Density Interconnect Conference
Career Center | Malibu, California USA | Management
Title: President / General Manager Location: Southern California Experience: P&L Technical degree Supervise: QA, Operations, engineering & marketing 10 years plus high-density electronic components Salary: $150K + Email resume to: tmyers@electronicc
Career Center | Marietta, Georgia USA | Engineering,Production
Currently seeking a senior pcb designer with Veribest cad experience. Knowledge of RF circuit design parameters, high density, multi-layer, and double sided. Analog/digital smd circuit board strongly desired. Designer will be responsible for pcb boar
Career Center | GOBICHETTIPALAYAM, India | Engineering
PCB design, layout and packaging of high-speed, high-density, Mixed Technology Analog / Digital signals & RF signals, Flex, Rigid board, Commercial, Application Boards, based on client requirement and Quality Inspection of the design.
SMTnet Express, March 1, 2018, Subscribers: 31,280, Companies: 10,908, Users: 24,452 Deposition of Solder Paste into High Density Cavity Assemblies Fernando Coma, Jeffrey Kennedy, Thilo Sack; Celestica Corporation Circuit functional density
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/hdi/
High Density Interconnect (HDI) PCB Technology | Imagineering Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3151&OB=ASC.html
Density Option For BGA's - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Density Option For BGA's
