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New Equipment | Curing Equipment
IR Oven Curing Oven - Fast and Uniform Heating for Superior Results Product Description I.C.T IR oven is cost-effective Curing Oven produced by I.C.T, mainly to deal with the application of glue curing,special soldering,SMD testing, Anti-corrosi
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New Equipment | Curing Equipment
IR Oven Curing Oven - Fast and Uniform Heating for Superior Results Product Description I.C.T IR oven is cost-effective Curing Oven produced by I.C.T, mainly to deal with the application of glue curing,special soldering,SMD testing, Anti-corrosi
Nordson ASYMTEK’s advanced multiple camera imaging technology offers high-speed inspection with exceptional defect coverage. With dual sided viewing (top-down and bottom up) cameras and UV lighting the FX-942 ACI inspects conformal coating coverage a
New Equipment | Coating Equipment
The Select Coat Applicator Series – which includes the SC-350 Select Spray and the SC-300 Multi-Mode – is a highly-versatile conformal coating applicator that supports a wide range of fluid viscosities and is ideal for solvent or solvent-less fluid f
Near Equilibrium Hot Gas Heating makes the CUREFLOW series the only choice for SMT Convection reflow and curing applications. 3 models to choose from.
New Equipment | Curing Equipment
For curing and drying requirements, rehm�s RDS series is available with completely customized heating and cooling lengths. Our modular design concept allows us to outfit the RDS with any combination of heating (Convection and/or IR), cooling, and UV
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
25 Sealants LOCTITE 5210 One-component ultra fast curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applic
IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
