The Most Intelligent Soldering Station in the World. Highest quality hand soldering via innovative technology. Guaranteeing quality in a lead-free environment puts the greatest demands on hand soldering applications. Today's hand soldering operato
Sales Manager: Sandy Lin Email: firstname.lastname@example.org Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,
Electronics Forum | Wed Apr 03 10:50:06 EST 2002 | BTaylor
Any time Dave I can tell from your responses you have been around this block as many times as I have.Your right automotive is tough nowadays not only from the quality standpoint, now they want everything for free.
Electronics Forum | Fri Sep 17 19:27:50 EDT 2004 | debh
Are industry time standards based on actual time...or money? From a start to stop time on a multi-machine SMT line our time is well below standard. (Our company uses industry standard (I'm told) based on .09 sec. per placement.) However each pick an
Industry News | 2020-02-18 13:50:30.0
Datest announces that the company’s president, Robert Boguski will present at the SMTA Intermountain (Boise) Expo & Tech Forum, scheduled to take place Tuesday, March 10, 2020 at Boise State University - Jordan ABC Room in Idaho. Boguski will present “New Developments in Digital Computed Tomography (CT) for Nondestructive Failure Analysis of PCBFs/PCBAs.” Datest also will be an exhibitor and is the tote bag sponsor at the expo.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 1999-05-09 13:05:12.0
This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one.
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, Global Market Insights, Inc reported in their research that the electronic manufacturing services sector is expected to reach $650 billion by 2024. This global industry growth is spurred by the exponential demand for consumer electronics and devices such