The Szero1 is an “odd components” LED control position storage cabinet. Szero1 is a component storage cabinet specifically designed for ‘odd form’ component storage. It is ideal for large reels (over 40mm width), PCBs, sticks, matrix trays, PTH comp
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Electronics Forum | Tue Feb 29 19:30:09 EST 2000 | Hon Choi
Good Day, Can anyone tell me if component dimensions are standardized from vendor to vendor? For example, would an sot89 component from one vendor have the same dimensions, lead pitch and length as that from another vendor? And is there any place
Industry News | 2009-03-25 23:00:03.0
DORSET, UNITED KINGDOM - March 2009 - Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces it is the recipient of the 2009 Frost & Sullivan Award for Product Differentiation Innovation in the Global SMT Placement Market.
Industry News | 2013-10-31 13:57:36.0
Europlacer announces that it finalized an OEM partner agreement with IEMME SPA, headquartered in Varese, Italy to offer its full range of Automated Storage Solutions.
Introduction of KIC start furnace temperature tester Processing customization: Yes Brand: US KIC Model: KIC start Measurement range: - 150-1050 (℃) Temperature measurement resolution: 0.1 ℃ Temperature measurement accuracy: + / - 1.2 ℃
Stainless steel SMT PCB Rack LABERACK Magazine Specification: Material:Chroming carbon steel or stainless steel Overall Size: (Any dimensions and specifications are available on request)
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2012-11-21 18:57:58.0
The continuing evolution toward advanced miniature packaging has led to ever increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is an ever increasing probability for defects to occur on finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship on electronic assemblies. While advancements in conventional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper component orientation, insufficient solder, and solder bridges; there is an inherent limitation in the ability to inspect for co-planarity of ultra-miniature chips, leaded device, BGA and LED packages.
http://www.gpd-global.com This amazing taped Radial components is capable of forming a variety of forms including flushmount, standoff, and lock-in (dependent on inserted dies). Find out more http://www.gpd-global.com/co_website/leadformers-cf9.php
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Events Calendar | Fri Aug 28 14:00:00 EDT 2015 - Fri Aug 28 02:30:00 EDT 2015 | New Bedford, USA
Webinar: Flex & Rigid-Flex PCB's - Applications and Cost Drivers
Career Center | Torrington, Connecticut | Engineering,Management,Production,Quality Control,Sales/Marketing,Technical Support
MECHANICAL AND ELECTRONIC CAD TECHNOLOGY-CERTIFICATION • TECHNICAL DRAFTING: Equipment Use, Orthographic Projection, Dimensioning, Auxiliary Views, Fasteners, Manufacturing Processes and Fits and Tolerances • POWER TRANSMISSION/ANSI 14.5 1994: Bearin
Career Center | FARIDABAD, HARYANA India | Engineering,Maintenance,Management,Production,Quality Control
SMT Maintenance ( Samsung Techwin Screen Printers, Solder Paste Inspection, Panasonic & Fuji Chip Mounters & Multi Mounters, Heller Reflow Machines, Functional Testing Inline Machines, Epoxy Dispensors, Underfill Reflow, Routers) Industrial Enginee
JUKI SMT Machine spare part JUKI Manual tray Plate Dimension: 285mm x165mm JUKI Manual tray Plate Leave a Message We will call you back soon
. Measure the inside dimension of the formed component. If the measurement is .470, skip to Step 3. If the measurement is not .470: a. Subtract the dimension from .470