Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 5 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Immersion gold over nickle
Parts & Supplies | Circuit Board Assembly Products
1). Laird aluminium backed 2). T-Prepreg 1KA Dielectric 3). Low Thermal Resistance for Cool & Efficient LED Operation 4). 1.6mm thick, single sided, 1 oz 5). Black solder mask/No ident 6). CNC rout outline 7). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1) Rogers4350B/4003C, Double-sided Layer, 2) 0.5mm thick/0.2mm thick 3) 1/1 oz copper thickness 4) Line space width: 0.15-0.2mm 5) Immersion gold.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4, Tg 170, 1 oz copper finished 2). 4 layers, 2.5mm thick 3). Min.track/space: 4/4 mil 4). Min. hole size: 0.25mm 5). 50 ohm, 100+/-10% ohm differentail /single impedance control 6). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold
Parts & Supplies | Circuit Board Assembly Products
1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting holes
Parts & Supplies | Circuit Board Assembly Products
1). 80*50mm/1up, Bergquist Thermal Clad aluminium backed 2). LTI-04503,MP-06503,ML-11006 3). Ceramic dielectric material, conductivity: 1.3W/m-k, 2.2W/m-k, 4). 1.6mm thick, single sided, 35μm (1 oz) 5). Black solder mask/no ident 6). CNC rout outli
Parts & Supplies | Circuit Board Assembly Products
1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm，6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg170, Lead-free, Low Z-axis CTE, Low water absorption. 2). Excellent thermal stability and anti-CAF performance 3). 2-30 layer, 1.6mm thick 4). 1 oz copper finished 5). 10% impedance control 6). Immersion gold, HASL LF. 7). Suitable for hig
Parts & Supplies | Circuit Board Assembly Products
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
