Electronics Forum | Sat Aug 03 08:44:11 EDT 2002 | P. Kannan
We are having 3 MPM UP-2000 printer & 1 AP-25 printer with us. I would like to have the technical guidance for my following application. For one of our model, there is a requirement of Glue & solder paste on same side of the PCB. Currently we are u
Electronics Forum | Tue Mar 07 15:11:43 EST 2006 | davef
We wouldn't know a Gemini from a bread box, nor we are real clear on what you seek. So, we'll just rattle on for a while. Here's how we monitor the quality of our dispensing process: * We dispense the same nonfunctional pattern of dots on every boa
Electronics Forum | Tue Mar 07 10:06:29 EST 2006 | pjc
Can't measure, but there is a dot inspection capability with the 401 auto-vision option that you should have on your Gemini. Check the manual or call Speedline Tech support for instructions, 800-737-8110. This option allows you to teach a "golden dot
Electronics Forum | Fri Apr 09 08:58:28 EDT 1999 | Justin Medernach
| I'm not sure about limits but perhaps underfilling the BGA might easy your mind. Treat the BGA as something similar to a flip chip and dispense underfill around the part. The rigidity gained by the cured underfill may be enough to alleviate some
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