Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 3010ACL high-speed chipmounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed highquality electric production line of
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Used SMT Equipment | SMT Equipment
Product name: KE – 3010ACL high-speed chip mounter Acl. Product code: KE - 3010 Detailed product introduction Characteristic： Constantly improve the KE series products. So as to realize the high speed high quality electric production line of f
Used SMT Equipment | Pick and Place/Feeders
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Used SMT Equipment | Pick and Place/Feeders
Model:NXT-M3S PCB size:Min.48*48mm;Max.510*534mm(Double track) Placement speed:H12HS:22,500;H08:10,500;H04:6,500;H01:4,200 Patch range: H12S:0402~7.5x7.5mm Height:MAX:3.0mm H08: 0402~12x12mm Height:MAX:6.5mm H04: 1608~38x38mm Height:MAX:13mm
Used SMT Equipment | Soldering - Reflow
The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5
Used SMT Equipment | Soldering - Wave
Operating System: Windows based Details: • Dual pot-Lead and Lead Free • Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder • Carbon Steel Solder pots with high temperature protective coating • A
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI/SPI SPIHS60 MACHINE PARMI HS60 (supreme) solder paste thickness tester SPI The SPI HS60 (supreme) series is the next generation fastest online solder paste inspection system on the market. The measurement speed at a resolution of 13x13um is
Used SMT Equipment | Soldering - Reflow
(2) Vitronics XPM2 Reflow Ovens - Auction Items www.xlineassets.com - Auction September 10th Other Available Equipment in Same Auction: • Fuji CP65 Chipshooter, SN 793, 0201 Camera Fuji • QP 351-MM Pick and Place System • Fuji QP 351-MM Pick
Used SMT Equipment | Soldering - Reflow
Multiple Vitronics XPM Reflow Ovens Auction Item www.xlineassets.com Complete Factory Closure
