Industry Directory | Consultant / Service Provider
DownStream is a software company focused on helping engineering organizations automate the PCB Release Process. We offer tools that help optimize, validate and document PCB designs before they are released to manufacturing.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Electronics Forum | Thu Jul 30 16:50:41 EDT 2015 | lokit
In our production line we use the pick and placer My100 by Mycronics. We get a lot of feedback from quality department about IC's being placed upside down, wrong polarity. (Wrong polarity usually already delivered to us, or IC's placed in the sticks
Electronics Forum | Wed Aug 05 09:41:50 EDT 2015 | kmots15
For upside down and rotated parts try using the index mark (F6) in the package database for that component, at least then the machine should look for a unique feature on the bottom and if it cannot find it the part will be rejected. For the index ma
Used SMT Equipment | AOI / Automated Optical Inspection
Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2
Used SMT Equipment | AOI / Automated Optical Inspection
This machine is available for immediate purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: YesVis
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Parts & Supplies | Assembly Accessories
KGT-M654L-A0X SENSOR, DOWN 1 ASSY
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Parts & Supplies | SMT Equipment
YAMAHA Head Up Down Valve (54W) KM1-M7162-11X Jenny@ksunsmt.com
Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Wed Apr 03 00:00:00 EDT 2024 - Wed Apr 03 00:00:00 EDT 2024 | ,
Wine Down Wednesday: Save the Date
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | ,
Wine Down Wednesday: Starting a Female Owned Business as an EMS
Career Center | Seven Hills, Ohio USA | Engineering,Production
The qualified candidate will be responsible for the operation and progamming of pick and place machines. This will include operating screen printing equipment set-up of reflow and cleaning systems and tear down of said systems. Hand soldering of in
Career Center | Seven Hills, Ohio USA | Engineering,Production
The qualified candidate will be responsible for the operation and progamming of pick and place machines. This will include operating screen printing equipment set-up of reflow and cleaning systems and tear down of said systems. Hand soldering of in
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/can-manufacturing-induction-dryers-and-heaters/ecodry-compound-dryer
. Open-door interlock switches Over- and under-temperature alarms and shut-downs Integral exhaust blower purges moist air from induction tube Easy installation, all electronics housed in common
Heller Industries Inc. | http://hellerindustries.com/smt-solder-reflow/
. Mini cool coils can be placed in the heat zones for enhanced zone-zone thermal separation, or to achieve fast cool downs for rapid recipe changeovers
