Electronics Forum: dpak void (8)

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

Aperture shape for DPAK

Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh

Windowpane your ground planes, this will prevent a lot of voiding.

Industry News: dpak void (3)

Indium Corporation Names Silver Quill Award Winners

Industry News | 2019-01-16 20:44:36.0

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.

Indium Corporation

Indium Corporation Experts to Present at IPC APEX Expo

Industry News | 2019-01-08 20:28:27.0

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.

Indium Corporation

Express Newsletter: dpak void (106)


dpak void searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

Training online, at your facility, or at one of our worldwide training centers"
SMTAI 2024 - SMTA International

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
PCB Handling with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...