Specification ‧Humidity Range: 1%RH(±1%RH) ‧External Size: W1200*D672*H1815mm ‧Internal Size: W1198*D642*H1625mm ‧Capacity: 1250L ‧Shelves: 5 pcs(I/N:3-20-0020-02), adjustable ‧Loading Capacity Of Shelf: 100 kgs/per shelf ‧Display Precision
Specification Humidity Range:<5%RH External Dimension:W600*D672*H632mm Internal Dimension:W598*D642*H525mm Capacity:202L Cabinet Color: black Structure:1mm thick carbon steel with antistatic paint. ESD Paint: 103~109 ω (surface resistance)
Specification ‧Humidity Range: 1~50%RH, adjustable ‧External Size: W1200*D672*H1815mm ‧Internal Size: W1198*D642*H1625mm ‧Capacity: 1250L ‧Shelves: 5 pcs(I/N:3-20-0020-02), adjustable ‧Loading Capacity Of Shelf: 100 kgs/per shelf ‧Displa
Specification ‧Humidity Range: 20~50%RH, adjustable ‧External Size: W600*D672*H1275mm ‧Internal Size: W598*D642*H1070mm ‧Capacity: 411L ‧Shelves: 1 piece (I/N:3-20-0016-08), adjustable ; 2 pieces (I/N:3-20-0016-07), adjustable ‧Shelves(extended): 1
Universal X-ray cabinet to provide a maximum flexibility for inspection of small to medium sized parts. The XRH111 combines a compact footprint and minimum-cost layout with high-end features like Computed Tomography (CT) and Automatic Defect Recognit
T40W-1200-6 is a plug and play, fully auto dry cabinet which will be stable at 40C and 15C. Fresh News We will participate Productronica 2015 show. The world’s leading trade fair for electronics development and production. http://www.productroni
New Equipment | Curing Equipment
For curing and drying requirements, rehm�s RDS series is available with completely customized heating and cooling lengths. Our modular design concept allows us to outfit the RDS with any combination of heating (Convection and/or IR), cooling, and UV
Desiccant works inside the Dri-Shield moisture barrier bags to absorb residual moisture and keep the contents dry. Humidity indicator cards monitor the levels of humidity inside the bag during use.
CAPABILITIES Top and bottom side Fine pitch BGA PCB Design and PCB Layout of Prototype builds Testing HP 3070 Checksum ICT MEC custom PCB Design and PCB Layout Functional and final test X-ray Special Processes Encapsulation (potting) Confo