Industry Directory | Manufacturer
Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.
Industry Directory | Manufacturer
Bosch Static Control is a specialist in ESD & CLEANROOM Production Items and has several years experience in this specialist field.We have our very own production Facilties in Dongguan, China
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Mechatronika MR10 is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying. Soldering sections are controlled by a microprocessor, that also enables the storage of up to sixteen parametrized temperature
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Sat May 27 08:58:07 EDT 2000 | Thanas
Hi, I'm new in SMT & confusing to define the soldering defect criteria of cold solder, dry joint & dewetting. & what's the root cause for them ? FYI, I had read the IPC-A-610 rev. B , but doesn't help much. Any advise is very much appreciate. Thanks
Used SMT Equipment | Pick and Place/Feeders
Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mmcomponents, the wide range of special-shaped long joint element The height of the object elementcorresponds to 25.5 mm 10 ~ 30 n can be easy to stick
Used SMT Equipment | SMT Equipment
Product name: YS88 multi-function module chip mounter Product number: YS88 Products in detail The characteristics of Configurable ~ 0402 chip - 55 mm components, the wide range of special-shaped long joint element The height of the object elem
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2016-10-20 19:46:11.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
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Parts & Supplies | Pick and Place/Feeders
FUJI - JIG (Glass PCB Holder) There are also other FUJI spare parts for you ! N4014A SCREW,HEXSOCKETSET WQL1212 BKT S2113H CYLINDER,AIR S1022A CIR-CLIP,E-TYPE H4384A BEARING,NEEDLE M5021H MOTOR,INDUCTION H4008A HEAD,GE
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Parts & Supplies | Pick and Place/Feeders
FUJI - NOZZLE H08-H12 Nozzle 0.30MM AA1AT00-R07-003-070 There are also other FUJI spare parts for you ! N4014A SCREW,HEXSOCKETSET WQL1212 BKT S2113H CYLINDER,AIR S1022A CIR-CLIP,E-TYPE H4384A BEARING,NEEDLE M5021H MOTOR,INDU
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2022-12-23 20:44:54.0
One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured
Humitector™ Type 2 Humidity Indicator Card, used together with a Desi Pak® desiccant, can help provide a complete history of a dry pack environment for moisture sensitive surface mount devices (SMD's) (MSD - moisture sensitive
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
| https://pcbasupplies.com/alloy-solder-paste-enig/
& Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The proper storage and handling procedures during PCB assembly are clearly defined in the joint IPC/JEDEC standard J-STD-033A Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow
