Industry News: dull grey solder joint after cleaning (Page 1 of 11)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

IPC/SMTA Announce High-Performance Electronics Assembly Cleaning Symposium

Industry News | 2008-08-11 22:40:35.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA announce the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at the Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Surface Mount Technology Association (SMTA)

IPC International Conference in Budapest Highlights Process Steps for Manufacturing Quality Electronic Products

Industry News | 2011-01-22 00:27:29.0

Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

New SN100CV solder paste from Nihon Superior at SMTAI reduces voiding

Industry News | 2018-09-18 20:11:02.0

Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Industry News | 2022-06-24 10:13:15.0

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

Shenmao Technology Inc.

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

Nihon Superior to Address Key Industry Trends, Concerns at the SMTA Ohio Valley Chapter Meeting

Industry News | 2011-05-16 16:00:12.0

Nihon Superior announces that Keith Howell, Technical Director for the Americas, will present during the SMTA Ohio Valley chapter meeting on June 3, 2011 at the Dave and Busters in Hilliard, Ohio.

Nihon Superior Co., Ltd.

Z-AXIS Adds $1.2M in Equipment for Printed Circuit Board and Cable Assembly Services

Industry News | 2021-09-24 13:31:07.0

Investments over the past 18 months support continuing technology advancements and business growth at the electronics design and contract manufacturing center near Rochester, NY

Z-AXIS, Inc.

SHENMAO Develops New Joint-Enhanced Flux

Industry News | 2020-11-09 14:21:48.0

SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.

Shenmao Technology Inc.

EasySpheres Highlights RF741 No-Clean Gel Flux

Industry News | 2009-07-17 18:26:03.0

POWAY, CA — July 2009 — EasySpheres LLC highlights RF741 No-Clean Gel Flux designed for electronic component rework and repair applications.

EasySpheres LLC

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