Electronics Forum | Fri Apr 30 10:50:24 EDT 2010 | dldavis
Where do I find data which shows how much dwell time is excessive in a solder fountain when install through hole connectors into a polyimide board.
Electronics Forum | Mon May 03 11:20:43 EDT 2010 | mikesewell
A good guideline is keep it similar to your wave solder process, for example 2-3 sec. This assumes you're preheating the assembly. While polyimide boards are fairly robust at some point you will begin to see copper dissolution - the solder side pad
Electronics Forum | Mon May 03 10:52:18 EDT 2010 | davef
We're not sure that such data is available. What guidelines does your flux supplier provide in soldering with this process?
Electronics Forum | Fri Jul 30 09:59:10 EDT 2004 | Steve
Excessive Time above Liquidus will cause a solder joint to become extremely brittle. Any shock or stress to the joint can lead to a failure.
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Thu Jul 29 09:00:56 EDT 2004 | Bryan Sherh
Some short happens between the balls of CPU socket in my site.we decrease the reflow time from about 90sec to 50 sec and decreased the fail rate of short.but x-ray shows balls from part of the Ball array deformed....we can't further decrease the time
Electronics Forum | Wed Aug 04 15:27:03 EDT 2004 | Rush Fan
I might suggest that you check with your solder paste manufacturer to see what is recommended for time over reflow. Typically, I think most are between 60 and 90 seconds over 183. Also, consider the rate of cooling. The faster you cool the solder, th
Electronics Forum | Fri Jul 30 17:20:09 EDT 2004 | Francois Monette
A couple of other potential issues are moisture/reflow related issues. This can include internal delaminations inside the component, potentially breaking or lifting the wirebonds. It may also induce warpage where the corners of the BGA will curl up.
Electronics Forum | Mon Nov 06 21:09:47 EST 2000 | Dave F
That's cool that you used the Archive. Consider running a designed experiment on your board, using your flux and solder, the limits from the Archive, and on your machine to dial in the spread in dwell numbers you see in the SMTnet Archives to your s
Electronics Forum | Mon Jan 29 04:27:47 EST 2001 | wbu
Hi Sal, taking the dwell time as parameter to control seems to me unessary. Dwell time is a function of other settings that can be controlled (adjusted) more easily (conveyor speed, wavehight-settings, angle). Although dwell time is essential it�s I
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