Industry Directory | Manufacturer
Sikama International designs, develops, manufactures and markets reflow solder furnaces/curing systems, featuring our patented conduction+convection heating and cooling technology. Our furnaces are designed for efficient use of power and gas.
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
New Equipment | Wave Soldering
The Ideal Wave Soldering System for Low-to-Medium Volume Lead-free Pproduction. The award-winning ELECTROVERT VectraES wave soldering system features exceptional system-wide accessibility, an advanced control system and innovative sub-system technol
Electronics Forum | Fri Apr 30 10:50:24 EDT 2010 | dldavis
Where do I find data which shows how much dwell time is excessive in a solder fountain when install through hole connectors into a polyimide board.
Electronics Forum | Mon May 03 11:20:43 EDT 2010 | mikesewell
A good guideline is keep it similar to your wave solder process, for example 2-3 sec. This assumes you're preheating the assembly. While polyimide boards are fairly robust at some point you will begin to see copper dissolution - the solder side pad
Used SMT Equipment | Conveyors
onveyor Technologies MFIFO .6m -21 -4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass throughEach Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer21 Vertical Buffering SlotsAd
Used SMT Equipment | Conveyors
onveyor Technologies MFIFO .6m -21 -4048 Date of Manufacture: 2018 Details: Vertical FIFO/LIFO/Pass throughEach Buffer Position Consists of a Moving Belt Surface to Provide Smooth transition In and Out of the Buffer21 Vertical Buffering SlotsAd
Industry News | 2003-06-25 12:28:40.0
The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Technical Library | 2007-08-09 12:23:10.0
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.
Technical Library | 2021-04-21 15:10:16.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
Career Center | Melbourne, Florida USA | Engineering
I have over 24 years experience in the PCB manufacturing arena. My career knowledge is in most SMT manufacturing equipment. Creating and troubleshooting manufacturing assembly processes and creating detailed work instructions using Microsoft Power
Career Center | Thanjavur, India | Production,Quality Control,Technical Support
work in one year and above Quality engineer in sanmina,current work in SMT Technical engineer in coimbatore
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/applicators/lv-227-bead-gun
. Control adhesive output with integrated needle-stroke adjustment. Prevent adhesive skinning over nozzle during dwell times with nozzle cover
