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Technical Library | 2013-06-05 23:14:44.0
The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process.
Technical Library | 2010-09-10 09:47:06.0
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.
*Used Industrial Equipment: Key Technology Prism Sorter , Espec Environmental Chamber , CPak Shrink Tunnel , Dorner Flat Belt Conveyor , Affinity Triple Loop Chiller , SMC Triple Loop Chiller , Affinity Water Cooled Chiller
) DEK133128 TABLE LIFT MOTOR DEK133129 ACTUATOR "X"REAR LOOM BOM(TXT) DEK119715 Y' GEAR PULLEY DEK145511 BELT^TIMING 'Y' TRANSFER ( TXT ) DEK145513/157936 REAR DAMPER, 235N DEK140584 DRIVE BELT^PRINT CARRIAGE^ (TXT) DEK185935 BELT^FLAT^ESD