Electronics Forum: e20 (Page 1 of 1)

What material to use for component staking?

Electronics Forum | Mon Jan 18 15:07:12 EST 2010 | mikesewell

Usually the print specifies the material since the design is qualified with it in place. I've used several from Scotchweld 2216, Scotchweld DP190, Hysol E-20HP, to NASA outgassing qualified Masterbond 10HT.

no-clean process

Electronics Forum | Fri Mar 28 21:54:54 EST 2003 | MA/NY DDave

Hi Notice they do call out that you should use their thinner. In the MSDS you get a clue as to the thinner they are mostly using with some additives. http://www.kester.com/PDF%20FILES/PDF%20Data%20Sheets/E%20No-Clean%20Fluxes/951%20(30Mar98)logo.p

15.7 mil QFP

Electronics Forum | Fri May 30 20:54:53 EDT 2003 | jonfox

Conversion refresher: 1 inch = 25.4 mm 1 inch = 25,400 microns 10 microns = 0.3937 mils 10 microns = 0.010 mm so 0.4mm = 400 microns and for s/n/g: 1mm = 3.240783e-20 parsecs (pc) Have some fun with that one!

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Tue Jul 18 09:05:54 EDT 2017 | davef

Acceptability of Electronic Assemblies IPC-A-610 F Comparison E to F versions * http://www.electronicsyorkshire.org.uk/UserFiles/PDFs/610E%20to%20F%20Redline%20comparison.pdf * https://www.youtube.com/watch?v=kD5NpsocTpw * http://www.scanditron.c

Flex Circuit Suppliers

Electronics Forum | Tue Jul 05 15:24:16 EDT 2005 | davef

60% assy Hutchison||150||150||Disk drive suspension||Flex only, no assy Parlex||130||75||Automotive||Low assy, increasing Innovex||95||40||Disk drive suspension||High assy in other applications Multtek Flex||64||64||Automotive||Low assy, increasing T

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