| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
] gold thickness and all through-hole leads that will be hand soldered regardless of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
assembly to avoid damaging components during assembly. The finishing material of aerospace PCBs should be able to tolerate harsh environments. The most common choices include: Electrolytic nickel and gold. Electrolytic wire bondable gold. Electroless nickel
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
] gold thickness and all through-hole leads that will be hand soldered regardless of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Board thickness, finished hole size, board plating material, flux type and application method and type of solder all affect this possible defect
| https://www.smtxtra.com/shop/machine-sales/ekra-x5-36-screen-and-stencil-printer-year-2013-serial-nr-805759/
EKRA X5-36 Screen and Stencil Printer, Year: 2013 (Serial Nr: 805759) - SMT Xtra About Us Contact SMT XTRA +44 (0) 1302 247295 HOME SMT NOZZLES ASM (Siemens
| https://www.smtxtra.com/shop/machine-sales/ekra-x5-professional-large-screen-and-stencil-printer-year-2014-sn-805843/
EKRA X5 Professional Large, Screen and Stencil Printer, Year: 2014 (SN: 805843) - SMT Xtra About Us Contact SMT XTRA +44 (0) 1302 247295 HOME SMT NOZZLES ASM (Siemens
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