Industry News: electromigration method (Page 1 of 1)

4th International Symposium on Tin Whiskers

Industry News | 2010-02-23 16:29:14.0

The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.

CALCE Center for Advanced Life Cycle Engineering

Cobar’s Gerjan Diepstraten to Present at SMTAI 2010

Industry News | 2010-10-04 16:59:29.0

The Balver Zinn Group announces that Gerjan Diepstraten will present a paper titled "Clean 'No-Clean' or Use a Water Wash Solder Paste?" at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Cobar Solder Products Inc.

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