ERS provides scalable and flexible sensor and actuator network systems. We can help you detect, monitor, and control anything you want, from where you want, and at the time you want, no matter how distributed, remote or complex.
Industry Directory | Research Institute / Laboratory / School
NESL is engaged in research on architecture, design, and tools for networked and embedded computing and communication systems.
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Vision Systems offers a full range of Industrial PCs from the following categories: Embedded Box PC DIN Rail PC (Embedded Systems for DIN Rail mounting) Compact Systems 19" Rackmount PC Vehicle PC (Embedded Systems for in-vehicle computing sol
Electronics Forum | Mon Jan 19 20:39:47 EST 1998 | Tony Sturgeon
We are an embedded computer company that does our own assembly. We currently use a "home grown" software creation to track our product quality. I am interested in replacing this software with an "off the shelf" solution, if possible. Do you have
Electronics Forum | Sat Jan 24 16:05:06 EST 1998 | Bill
| We are an embedded computer company that does our own assembly. | We currently use a "home grown" software creation to track our | product quality. I am interested in replacing this software | with an "off the shelf" solution, if possible. Do y
Used SMT Equipment | In-Circuit Testers
Exfo WA-7000 Exfo-Burleigh WA-7000 Wavemeter Features: The most complete WDM channel analysis Simultaneous Measurement of as many as 200 Optical Channels Multiple and average wavelength measurement to an accuracy of +-1.5 pm
Used SMT Equipment | In-Circuit Testers
Tektronix MSO4104 Mixed Signal Oscilloscope Features & Benefits Key Performance Specs 1 GHz, 500 MHz, 350 MHz Bandwidth Models 2 or 4 Channel Digital Phosphor Oscilloscopes 16 Digital Channels (MSO4000) Suite of Advanced T
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2003-03-18 10:12:41.0
The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.
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Parts & Supplies | SMT Equipment
03003217-01 Computer Unit without MVS SIPLACE HF 03003232S01 STRIPPING PLATE / ROCKER X8 03003236S01 VACUUM GENERATOR ASSY SP-HF 03003261S01 Vacuumdistributor complete 03003268S01 Dual Holder for Vacuum Generator 03003277S01 ROCKE
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Parts & Supplies | Pick and Place/Feeders
03003217-01 Computer Unit without MVS SIPLACE HF 03003232S01 STRIPPING PLATE / ROCKER X8 03003236S01 VACUUM GENERATOR ASSY SP-HF 03003261S01 Vacuumdistributor complete 03003268S01 Dual Holder for Vacuum Generator 03003277S01 ROCKE
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2014-07-17 17:01:10.0
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This is intensified by the high ambient conditions experience by today’s modern warfighter. In many applications liquid cooling is replacing air flow through chassis for both thermal and environmental benefits(...) This paper outlines a series of passive thermal improvements which are easily integrated into legacy, or existing, systems and can provide a 3-4x increase in dissipated power.
03003217-01 Computer Unit without MVS SIPLACE HF 03003232S01 STRIPPING PLATE / ROCKER X8 03003236S01 VACUUM GENERATOR ASSY SP-HF 03003261S01 Vacuumdistributor complete 03003268S01 Dual Holder for Vacuum Generator 03003277S01
03003217-01 Computer Unit without MVS SIPLACE HF 03003232S01 STRIPPING PLATE / ROCKER X8 03003236S01 VACUUM GENERATOR ASSY SP-HF 03003261S01 Vacuumdistributor complete 03003268S01 Dual Holder for Vacuum Generator 03003277S01 ROCKE
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Addison,Texas, Texas USA | Engineering
RF TEST ENGINEER The selected candidate will develop test sets for testing printed circuit boards used in vhf transmitters and receivers. The ability to develop test software and hardware for automated control of test equipment, fault isolation and
Career Center | Fremont, California USA | Engineering
Define validation test plan for SSD’s and other Flash products. Implement a test plan strategy and to develop test methodologies to cover product specification for SSD’s and other Flash products. Assist in selection of test hardware and writi
Career Center | Gainesville, Georgia USA | Production,Quality Control
�Strong mechanical background in building computers and systems. �Experienced in soldering, assembly, and quality control techniques. �Familiar with ISO 9001:2000 certification standards. �Experienced with computer, cable, mechanical and electronic a
Career Center | Gainesville, Georgia USA | Production,Quality Control
SKILLS/ATTRIBUTES: Strong mechanical background in building computers and systems. Experienced in soldering, assembly, and quality control techniques. ISO 9001:2000 production department. Experienced with computer, cable, mechanical and electroni
SMTnet Express, July 17, 2014, Subscribers: 22938, Members: Companies: 13943, Users: 36480 Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications. Darren Campo, Jens Weyant, Bryan Muzyka; Advanced
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/nordson-yestech-helps-trenton-systems-ensure-consistent-quality-for-its-us-made-technologies
. The servers use Trenton Systems’s U.S.-made single-board computers, backplanes and embedded motherboards for critical embedded computing applications
Imagineering, Inc. | https://www.pcbnet.com/blog/the-importance-of-thermal-management-in-pcb-manufacturing/
% of printed circuit boards fail because of heat stress. The management of thermal loads on PCBs and their components is crucial to the longevity of the electronics they are embedded in
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