Industry News | 2003-03-05 08:35:10.0
he will be responsible for formulating R&D strategies and spearheading the Company to keep abreast of the latest development in global manufacturing technology as well as strengthen its R&D division.
Industry News | 2003-06-10 08:56:19.0
Seeing the increasing number of electronic products having image capturing functions in the market, the Company has decided to seek to further augment its manufacturing capabilities to produce image sensors to satisfy order demand for these components.
Industry News | 2018-10-18 08:05:54.0
The benefits of hard oxidation treatment of wave soldering mahcine and reflow oven guide Rail
Industry News | 2018-10-18 10:41:30.0
The Sizes and Usable Areas of PCB Panels
Industry News | 2012-10-29 09:36:36.0
IPC and SMTA jointly announce the keynote speaker and the topics you need to hear during session 6 of the IPC/SMTA High Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2010-11-18 11:21:04.0
IPC has released the training and certification programs for revision E of IPC-A-610, Acceptability of Electronics Assemblies, and J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.
Industry News | 2018-10-18 10:12:06.0
Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2011-07-14 11:02:39.0
The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 17, 2011 as a focused symposium at SMTA International in Ft. Worth, TX.
