The anti-wobble tool is designed for enhanced functionality when handling INTEL LGA CPU products. This tool improves placment accuracy when picking processor chips from a shipping tray and placing into precision sockets. This BULB-VAC features an ant
Whatsapp+86 13425164065 Our AB Potting machine helps AB compounds offer superior protection for electronic circuits industry Our Universal equipment is widely works for epoxies, silicones and polyurethane compounds , we configure different function
Electronics Forum | Fri Mar 24 15:20:27 EST 2000 | Chris McDonald
I have recently purchased a Tape and reel machine from V-Tech. We are using Presure Sensitive tape and we are not geting good results. Anything bigger that a SOIC14/16 gives us trouble. The cover tape will pull off on the feeder and we will lose part
Electronics Forum | Thu Mar 31 12:13:28 EDT 2022 | cbart
That is a tough one because of package size I agree, as noted previously it would be good to know what the current PCB pad layout is. first thought does go right to an adapter board of course! is this a volume build or just 20-50 pcs? dead bug and ha
Industry News | 2013-03-25 15:35:04.0
Ersa will present innovative production equipment, attractive all-inclusive packages and an extensive range of services for electronics production at the SMT trade fair held from 16 to 18 April 2013 in Nuremberg/Germany.
Industry News | 2014-04-16 13:17:25.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # B-1F25 at NEPCON China, scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.
Technical Library | 2019-05-06 23:04:05.0
The temperature and humidity test chamber simulate the temperature and humidity, so there are a lot of things customers shoud notice in the process of use, although there is detailed instruction when purchasing the equipment. But some users just know how the device works and start using it. This is very easy to cause problems in the use of the equipment, so Symor intends to describe the safety details during the use of temperature and humidity chamber. 1. Before the test, determine if the sample contains flammable and explosive substances to avoid combustion or explosion during the test. Of course, also make sure there is no flammable and explosive material around the test equipment, otherwise it may cause fire and other accidents. 2, Do not open the chamber door to operate during the experiment, or the gas in the studio may cause the operator to burn and so on. 3. At the end of the test or at the time of regular cleaning of the test chamber, power off the equipment to avoid electrocution accidents. Also, when cutting off the equipment power, pull the power cord to pull out the plug, otherwise it may lead to a rupture of the power cord and so on. You can contact manufacturers if there are some places you donnot understand, do not dismantle and repair the temperature and humidity test chamber without authorization, otherwise it may lead to more serious problems.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
ECOCELL is a high end selective soldering system to integrate into lean-manufacturing concepts (U-Shape). Combined with VERSAEYE module + handlingssystem in front of the machine we ensure highest quality with highest throughput. ECOCELL ? https://www
| https://unisoft-cim.com/gerber-connection_download.htm
. Next click FILE from the main menu, click OPEN, click CONTINUE and click the pull down menu next to "LIST FILE TYPES", for the sample PCB assembly ( PCBA
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
