Electronics Forum | Fri Mar 27 10:04:51 EDT 2009 | ericthered
We have been having problems with proper wetting when running mainly lead free but also leaded solder in our Ersa Hotflow 3. Solder either often looks grainy or doesn't flow over the whole pad. This is generally the case when my profile is 170 firs
Electronics Forum | Sun Apr 12 21:37:52 EDT 2009 | padawanlinuxero
HI !!! We have the same oven! and yes profiling is hard, but not that bad. Check with the solder paste company for information, right out of my head dont remember for the temps that we use on mondayIcan show you my profile so that youhave an idea
Options: (1) IR-preheating, bottom side segmented pin/chain and roller conveyor for versaflow with double soldering module programmable conveyor width adjust (4) convection preheating top side automatic solder wire feeder, solder
ERSA VERSAFLOW 4050 DUAL POT SELECTIVE SOLDERING SYSTEM Condition: Condition superior to inline with its age Manufacturer Description: The ERSA Versaflow is a fully automatic in-line selective soldering system operating within a nitrogen atmosp
Industry News | 2015-09-21 11:39:28.0
EMS provider Season Group in Texas is continually upgrading their manufacturing capabilities. As part of this process; they will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on October 5, 2015 and the closing will begin at 11:00am EST on October 6, 2015.
Industry News | 2013-09-24 14:34:40.0
In the cool November weather in Munich, IPC’s Hand Soldering Competition is sure to heat things up at productronica 2013, stand A3.415.
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Technical Library | 2012-03-15 17:50:28.0
The competition in the EMS sector has considerably intensified over the last few years,. The enormous pressure to reduce production costs, which every service provider today has to face, frequently forces the organization to have a critical look at their
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
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