Industry Directory | Manufacturer
DriSteem provides reliable and efficient humidity control, evaporative cooling, and water treatment solutions for commercial and industrial applications.
Utilise Gold contains an international business directory of suppliers of precious metal materials used in the electronics industry, including contacts, plating salts, pastes, solders, bonding wires and evaporation materials.
New Equipment | Solder Materials
Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications. Use of Common Flux Thinner is suggested when the flux acid number is too high due to solvent evaporation or residues
New Equipment | Cleaning Equipment
Evaporative Cooling Pad With the support from our meticulous workforce, we are introducing an extensive array of Evaporative Cooling Pad. The offered product is manufactured using superior quality basic material and advanced technology with the set i
Electronics Forum | Thu Oct 21 09:48:37 EDT 1999 | Larry J
Is it possible for flux to evaporate out of the solder paste, and how long would it take? What kind of effect would this have on reflow if all the flux evaporated?
Used SMT Equipment | Other Equipment
EMC Evaporator IBE SMT Inventory ID : 151201-001 EMC Serial Number : 7809908 Vintage : Details • Model: 85ESS • 240 VAC 3-Phase 40 FLA 60Hz Click Here for more details or to request a quote online... IBE SMT Equipment 281-259-9660 Off
Used SMT Equipment | Board Cleaners
Tank Capacity: 85 gallons (322 liters) Heat: 12,000 watts total heat at 230 Volt, 3 Phase. Heaters are derated at lower voltages. Overall Dimensions: 38" x 48" x 40"H Shipping Weight: Approximately 600 lbs. Evaporation Rate: 4 - 6 gallo
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Technical Library | 2019-04-11 06:04:49.0
With the development of science and technology, the climatic chamber quality has been improved, and the failure rate is reduced, but there still have the failure probability.today we introduce what are the mian factors for big noise high low temperature test chamber: 1.External factors: the bottom angle is uneven, the ground is uneven, adjust the bottom angle, ensure the equipment is in a horizontal position; 2.The equipment is touched other objects or pushed against the wall,pls remove the objects and keep a certain distance from the wall. 3.Compressor noise:check whether the compressor collides with the pipeline,and evaporator dish is loose or not. 4.Check whether compressor shock absorbers are aging and replace them. 5.Solenoid valve noise: solenoid valve reversing caue loud sound, pls add damping glue, if no effect, need to replace solenoid valve. If there is AC noise, need to replace the power board. 6.Check wether the fan or the fan string shaft make noise,whether the fan blades are touched and deformed, whether the fan is fixed or not, pls adjust accordingly or add the rubber pad. If further technical questions,contact us without hesitation!---Climtest Symor® technical team
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Water-based cleaning agent for SMT stencil printer underside wipe systems VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printer
Events Calendar | Thu Jul 20 00:00:00 EDT 2023 - Thu Jul 20 00:00:00 EDT 2023 | Suwanee, Georgia USA
Atlanta Chapter Technical Meeting: The Science of Humidity Control in Manufacturing
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
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. LEE cutter grinder model A600 Victor surface grinder 1022AD Ramco FM-CO1 surface grinder Clausing Lathe model 8031, 15” Bridgeport Explorer X-26, 3 axis mill Bridgeport vertical mill Telesis Marking Machine TMP6100/090 LSS surface roughness tester SR 300 EMC water evaporator Model 120GSS Misc Lathes, vidmar cabinets
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