Industry Directory | Manufacturer
Since 1999, Dresden, Germany-based, FILLING EVOLUTION GmbH, has excelled as a premier filling machine manufacturer, specializing in cutting-edge FILLOGY® machines, showcasing innovation and precision.
Industry Directory | Consultant / Service Provider
The ThermalAir temperature products are a series of high capacity thermal air stream systems that are used for temperature testing, fast thermal cycling and device temperature characterization of comp
Yamaha Σ-G5SⅡ Premium Modular PCB Chip Shooter ❙ Features of Yamaha PCB Chip Shooter High-efficiency SMT pick and place machine, Yamaha chip shooter, Yamaha module type mounting system with combine high productivity,, high
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Electronics Forum | Fri Jan 24 19:49:40 EST 2003 | jonfox
QSA series was a joint project, but Quad machines still use feeders made by Samsung, or Samsung makes the feeders Quad designed (whatever). QSoft has two different evolutions, Qsoft(1) went to Samsung, and Qsoft(2) stayed with Quad. I'm sure they h
Electronics Forum | Wed Nov 04 17:47:51 EST 2009 | locostpp
Q3/2009 been and gone. We are moving forward with low cost p&p, quite a few things have changed. We are applying for a number of patents for the feeders, placement head design, servo design, calibration system , etc... We now expect the price of t
Used SMT Equipment | Pick and Place/Feeders
Model YSM20R Applicable PCBSingle lane L810xW490 to L50xW50Dual stage Note: For X-axis 2-beam option only 1PCB conveyance: L810xW490 to L50xW5 2PCBconveyance:L380xW490 to L50xW50 Head / Applicable componentsHigh-Speed Multi (HM) Head"
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz SMU200A-K50-K51 The R&S SMU200A Vector Signal Generator not only combines up to two independent signal generators in one cabinet of only four height units, it also offers unrivalled RF and baseband characteristics. The generator h
Industry News | 2022-05-23 21:35:08.0
Blackfox Training Institute is proud to announce their latest development in their Veteran Advanced Manufacturing Certification program. This program was originally launched in 2013 and more than a hundred Veterans have been through it since. It was created out of a partnership between Blackfox Training Institute, Lockheed Martin, Colorado Department of Labor & Education, and a deep passion for serving those that have served and protected us. Over a hundred Veterans were trained and subsequently employed at advanced manufacturing companies along Colorado's Front Range.
Industry News | 2023-11-13 12:28:17.0
MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.
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Parts & Supplies | Pick and Place/Feeders
YangLing Anna share with you: Advantages of JUKI feeder. Totally according to idea of Juki 3E，ECONOMY、EXPANSION， EVOLUTION. Simple operation: Even never learning SMT operation before, also can control it very quickly. Expansion: Many updating par
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI feeder. Totally according to idea of Juki 3E，ECONOMY、EXPANSION， EVOLUTION. Simple operation: Even never learning SMT operation before, also can control it very quickly. Expansion: Many updating parts for customer choose,very sta
Technical Library | 2017-09-14 01:21:52.0
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.
Technical Library | 2018-02-01 00:31:48.0
This paper briefly summarizes the technologies underpinning the evolution in electrical system diagnosis and repair, which include schematic layout automation using prototypes and rule-based styling, instant language translation, 2D/3D view links with schematics, interactive diagnostic procedures, and dynamically-generated signal-tracing diagrams. These technologies empower after-sales service teams with state-of-the-art capabilities, which not only reduce costs but also improve brand quality in the eyes of its customers.
Yamaha Σ-G5SⅡ Premium Modular PCB Chip Shooter ❙ Features of Yamaha PCB Chip Shooter High-efficiency SMT pick and place machine, Yamaha chip shooter, Yamaha module type mounting system with combine high productivity,, high
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Wed Apr 28 00:00:00 EDT 2021 - Wed Apr 28 00:00:00 EDT 2021 | ,
Continued Journey of Equality Expo
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 11, (#ts#)) SMT Express, Volume 2, Issue No. 2 - from SMTnet.com Volume 2, Issue No. 2 Thursday, February 17, 2000
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/divisions/electronics-solutions?fb=1197fa6e9bdf4ed5b55aaf07c9df8123&div=bb08ae6983b64e9fb5da35878f14ced1&kw=Surface%2BPreparation%2BApplications&qs=t&page=2
. After investing heavily in upstream production processes, finish strong to protect your investment and reputation . Reduce stress on solder joints, improve mechanical support and stability, and protect chips from shock, moisture, and temperature changes with innovative precision dispensing and plasma treatment solutions for 2
40731 | https://www.smta.org/icehet/ICEHET-2020-Program.pdf
Surface Mount Technology Association (SMTA)
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