Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Industry Directory | Manufacturer
For Rapid PCB prototype deliveries (48 hours to 3 days), GSPK offer lead free HASL, IMMERSION SILVER or ENIG surface finishes. We can also committed to developing specialist PCBs i.e Ceramic and Heavy Copper PCBs
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD
Electronics Forum | Mon Sep 22 15:32:20 EDT 2008 | davef
We see this fairly often. It doesn't affect solderability. Our analysis makes us think this coloration is copper. The reason copper appears on the surface may be that heat cycles increase the thinness and porosity of the immersion silver [IAg] coatin
Electronics Forum | Thu Aug 29 17:51:43 EDT 2002 | nifhail
I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only h
Industry News | 2003-02-07 09:13:12.0
The Sessions Covered Current and Emerging Technologies
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
| https://www.eptac.com/faqs/ask-helena-leo/page/9
. Is there a special iron to use? Read More Silver Immersion Finish Boards QUESTION Question: We have a customer requesting us to use Silver Immersion Finish boards that are at least 5 years old
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
] that the immersion silver surface finish selected for lead-free PCBs had the susceptibility to creep corrode when used in high sulfur and high humidity environments
