Industry News | 2023-08-17 14:26:37.0
Today, KINGSUN shares with you the common types and classifications of SMT mounters.
Industry News | 2018-04-18 18:06:14.0
SMTA Europe announces Session 6 Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2008-06-30 14:17:39.0
LOS ALAMITOS, CA � June 30, 2008 � Practical Dummy Components is now supplying the Amkor FusionQuad�, representing a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad� QFP and MLF� technologies.
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
