Industry Directory: factors affecting solder short (1)

Arizona ProCoat LLC

Industry Directory | Manufacturer

Arizona ProCoat leads the industry in precision painting, conformal coating, potting and bonding

New SMT Equipment: factors affecting solder short (45)

Power Supplies - Board Mount

New Equipment | Other

A power supply is a device that converts other forms of energy into electrical energy and supplies electrical energy to a circuit (electronic device). It provides the electrical energy needed by all the components in a computer. The size of power sup

WIN SOURCE ELECTRONICS

KYZEN® E5615 - Fast Drying Stencil Cleaner

KYZEN® E5615 - Fast Drying Stencil Cleaner

New Equipment | Cleaning Agents

KYZEN® E5615 is an aqueous based cleaner designed to be the fastest drying chemistry in the industry. E5615 is shipped ready to use and successfully removes unreflowed solder paste from stencils and related equipment. Fast Drying No Rinse Require

KYZEN Corporation

Electronics Forum: factors affecting solder short (130)

Factors affecting solder quality

Electronics Forum | Thu May 26 21:13:17 EDT 2005 | thaqalain

Factors that affect the solder joint quality are *envirinmental condition(i.e.,humidity) *contamination *Flux residues *all of the above

IC short

Electronics Forum | Fri Jan 19 14:32:35 EST 2007 | Mike Hunt

What pitch IC? Perhaps a nickel stencil will work. Are your board FR4? Warping the board could play a major factor in solder shorting.

Used SMT Equipment: factors affecting solder short (2)

Test Research (TRI) TR7007 3D Solder Paste Inspect

Test Research (TRI) TR7007 3D Solder Paste Inspect

Used SMT Equipment | SPI / Solder Paste Inspection

SKU 16529 • Fastest solder paste inspection (SPI) system • Excellent 3D inspection • 3D SPI system for mid- to high-volume manufacturing • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 compon

SMT Devices

Test Research (TRI) TRI TR7007 3D Solder Paste Ins

Used SMT Equipment | SPI / Solder Paste Inspection

TRI TR7007 3D Solder Paste Inspection Technology, SPI, Year 2011 Test Research Inc. (TRI) Dynamic imaging offers an improved solution for 3D SPI in term of accuracy, speed and field of view (FOV). The main advantage of dynamic imaging is that inspe

SMT Devices

Industry News: factors affecting solder short (114)

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

DDI Corp. Provides Update on Negotiations with it's Senior Lenders and Convertible Noteholders

Industry News | 2003-04-04 08:46:37.0

Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002

SMTnet

Parts & Supplies: factors affecting solder short (2)

Surface Mount Techniques Solder paste Mixer

Surface Mount Techniques Solder paste Mixer

Parts & Supplies | Solder Paste Mixers

Solder paste Mixer Features: Unique contoured shape, generous appearance and practical, which is made by advanced coating process workmanship. Mixing principle is on the basis of Motor rotation and revolution mode of agitation, no need to defrost

KingFei SMT Tech

ACE Solder Paste Mixer

ACE Solder Paste Mixer

Parts & Supplies | SMT Equipment

Features: Unique contoured shape, generous appearance and practical, which is made by advanced coating process workmanship. Mixing principle is on the basis of Motor rotation and revolution mode of agitation, no need to defrost the paste. Need to r

Reliable Electronics Co.,Ltd

Technical Library: factors affecting solder short (9)

Identifying Flux Residues

Technical Library | 2019-05-23 10:42:00.0

Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.

ACI Technologies, Inc.

Risk Mitigation in Hand Soldering

Technical Library | 2019-01-02 21:51:49.0

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.

Metcal

Videos: factors affecting solder short (3)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

SIPAD Systems, Inc.

SIPAD Systems, Inc.

Videos

SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi

SIPAD Systems Inc.

Training Courses: factors affecting solder short (4)

Customizable Basic Hand Soldering

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Blackfox Training Institute, LLC

Wave Soldering 101 Training Course

Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: factors affecting solder short (3)

Screen Printing Key Factors

Events Calendar | Thu Apr 30 00:00:00 EDT 2020 - Thu Apr 30 00:00:00 EDT 2020 | ,

Screen Printing Key Factors

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference and Exhibition

Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands

Electronics in Harsh Environments Conference and Exhibition

Surface Mount Technology Association (SMTA)

Career Center - Resumes: factors affecting solder short (2)

Electronics technician

Career Center | NEW DELHI, India | Technical Support

I am having almost 20 years of experience in the field of electronics repairs domestic & industrial, able to work on any circuit and PCB without any schematic or diagram. I have all the records and certifications with me and fully c

SMT Manufacturing

Career Center | , | Engineering,Maintenance,Production

Production Planning ~ Supply Chain Management ~ Productivity Management ~ Sub Contracting Management ~ Process Quality Management ~ Process innovation & Lean Mfg ~ Cost efficiency Management ~ Manpower Management ~Multi Skilling & Training, Six Sigma

Express Newsletter: factors affecting solder short (1011)

Partner Websites: factors affecting solder short (68)

5 Common Solder Mistakes and How to Resolve Them

| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them

  occurs when two separate joints melt together as a result of applying excessive solder. The subsequent bridge creates an unplanned connection, directly affecting the overall functionality of the board

How to Prevent a Solder Ball Defect | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/

. Solder balls are conductive materials, meaning that if they roll around on a printed circuit board, they can cause electrical shorts, adversely affecting the reliability of a printed circuit board

Imagineering, Inc.


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