Electronics Forum | Tue Jan 30 07:29:21 EST 2018 | charliedci
I believe the correct statement (I've been told) is "the process is no clean". The solder paste is "low residue". As a CM, in the past we had customers that insisted on a wash after soldering. We used DI water with a saponifier which had mixed result
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Industry News | 2003-05-14 08:41:37.0
Both parties have rights to file petitions for rehearing by the United States Court of Appeals for the Ninth Circuit or petitions to the United States Supreme Court.
Industry News | 2018-10-18 09:56:07.0
What are the Factors Affecting the Cost of PCB Production?
Technical Library | 2019-08-24 09:02:25.0
Many customers looking for IC shipping tubes value the appearance of the packing tube. They will feel that if the appearance of the IC tube does not look good, the quality will not be very good, so the first impression of the appearance of the Antistatic ic tube is very important. So what are the factors that affect the appearance of IC tubes?
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/071117-three-external-factors-that-can-wreck-dispensing-outcomes
. These are just a few external factors that can affect your dispensing outcomes. Do you know of any others we could add? Feel free to submit them to marketing@nordsonefd.com
Imagineering, Inc. | https://www.pcbnet.com/blog/the-cost-of-pcb-fabrication-pricing-factors/
. Pricing Factors That Impact the Cost of PCB Fabrication At Imagineering, we have a convenient CPQ online that can help you manage your pricing
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