Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Tue May 08 16:06:51 EDT 2001 | caldon
www.empf.org empfasis news letter March 2001 issue "Manufacturing with BGA's" Reading this while impersonating Elvis will generate best results. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org
Electronics Forum | Tue May 08 18:42:05 EDT 2001 | mparker
Carol Doda?!!! She retired from the Condor club about 15 years ago. As for reference to all the other Plastics Princesses - God bless 'em all!!! 'Tis the time of year for halter tops and shorts - ye haw!
Electronics Forum | Wed May 09 10:42:24 EDT 2001 | davef
Retired!!!! Well, that certainly explains why I keep getting my Christamas cards returned, unopened!!!!
Electronics Forum | Thu Jan 14 12:39:31 EST 2010 | gregcr
Hi All, We have a glenbrook x-ray in house, but I am in need of a high resolution x-ray of some failed BGA image sensors. Does anyone know of a company that does hi-res or 3D x-ray service? We are not getting enough detail to really see what may be
Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park
Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?
Electronics Forum | Thu Jul 22 22:57:14 EDT 1999 | Earl Moon
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef
We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate
Electronics Forum | Thu Nov 07 14:30:38 EST 2002 | Debi Musante
We have been presented with the task of placing a BGA on top of a PGA. The previous process choice was to apply paste directly on the BGA (which failed functional testing) We are considering applying tacky flux (only) on BGA, since this is our first
