Industry Directory: failed solderability sn/pb (7)

SolderLab.com

Industry Directory | Consultant / Service Provider

An independent solder analysis lab. Our services include solder analysis of wave solder machines and solder pots. We test for impurities based on J-STD-006B for most tin and lead based alloys.

Aoki Laboratories Ltd. [Solder Products Supplier]

Industry Directory | Manufacturer

Aoki Laboratories Ltd. is an ISO-9002 certified company specializes in manufacturing of Sn/Pb Bar Solder, Cored Wire and Paste.Environmental friendly products, such as: lead-free solder, no-clean non-halide solder flux, no-clean cored wire and Non-CFC cleaner, are compliance with ISO-14001 requirements.

New SMT Equipment: failed solderability sn/pb (29)

IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies

IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies

New Equipment | Education/Training

This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure

BEST Inc.

Balver Zinn Alloys

Balver Zinn Alloys

New Equipment | Solder Materials

Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price

Balver Zinn

Electronics Forum: failed solderability sn/pb (900)

QFN - FCT failed after reflow

Electronics Forum | Tue Feb 06 23:01:44 EST 2007 | Wayne

The QFN is found to have contact problem during FCT. The paste that I am currently using is SnPb 63/37 water soluble paste. Is it because of water soluble paste? (unable to clean after reflow process as QFN is entrapped by paste/flux) Should we use

soldering ROHS boards with sn/pb components

Electronics Forum | Wed Aug 27 07:13:05 EDT 2008 | eyalg

I need to solder SAC/HASL PC boards in a NON ROHS process (Tin Leaded solder paste and profile + Tin leaded components) Can I do that?? Regards, Eyal

Used SMT Equipment: failed solderability sn/pb (12)

Speedline Electrovert Vectra 450/F

Speedline Electrovert Vectra 450/F

Used SMT Equipment | Soldering - Wave

Speedline Electrovert Wave Soldering Machine Model: Vectra 450F Year: 2001 Power: 480V / 3-Phase 3 Bottom-Side Preheat (2 Convection + 1 IR) 1 Top-Side Preheat (IR) Leaded Pot (63/37 SnPb)

Midwest SMT

Soltec 6622CC

Soltec 6622CC

Used SMT Equipment | Soldering Equipment/Fluxes

SALDATRICE A ONDA Sn/Pb SOLTEC 6622CC, vintage 2000, 3 x 400V con 400 kg di stagno nel pozzetto in ottime condizioni.

Technocare Electronic Systems

Industry News: failed solderability sn/pb (145)

Technical Library: failed solderability sn/pb (34)

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

Reliability of BGA Solder Joints after Re-Balling Process

Technical Library | 2012-10-04 18:52:43.0

First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t

Mat-tech

Videos: failed solderability sn/pb (9)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

IPC 7711 7721 Certification

IPC 7711 7721 Certification

Videos

The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair

BEST Inc.

Events Calendar: failed solderability sn/pb (2)

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA

FREE Webinar: Eliminate Circuit Board Problems and Failure Modes

Vision Engineering Inc.

Corrosion Testing For Electronic Equipment

Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Tue Feb 18 00:00:00 EST 2020 | ,

Corrosion Testing For Electronic Equipment

CALCE Center for Advanced Life Cycle Engineering

Career Center - Jobs: failed solderability sn/pb (1)

SMT Solder Specialist

Career Center | Clarksburg, Maryland | Engineering

Immediate opportunities for SMT Solder Specialist. Also have these positions open. All immediate opportunities: Assembler: Must have strong electro mechanical manufacturing skills. Experience with assembly of electro mechanical products in a high

Latitude Inc.

Career Center - Resumes: failed solderability sn/pb (4)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

Express Newsletter: failed solderability sn/pb (985)

SMTnet Express - January 8, 2015

SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard

Reliability of BGA Solder Joints after Re-Balling Process

Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO

Partner Websites: failed solderability sn/pb (22)


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