Industry Directory | Consultant / Service Provider / Manufacturer / Other
We develop produce and supply innovative cost effective thermal control units to major Semiconductor Devices Manufacturers to test IC devices -LOW & HIGH Power devices for temp range -65°C to +200°C.
Industry Directory | Manufacturer
At C I Network Technologies, we are capable of supporting our customers in development of products. Quick turn PCB assembly shortens the product development cycle and requires efficiency and precision.
New Equipment | Test Equipment
HAST (Highly Accelerated Stress Test) reduces the time it takes to complete humidity testing most commonly used for semiconductors. HAST Tests can be completed in days, not weeks. Any testing process that requires humidity testing may benefit from sw
PROCESS SCIENCES, INC. (PSI) Visit our main Laboratory Services page for more information. Failure Analysis, Material & Process Qualification. We are an analytical services laboratory dedicated to the electronic circuit assembly, printed circu
Electronics Forum | Tue May 06 14:52:37 EDT 2003 | bremerg
Pictures are now located at http://www.stevezeva.homestead.com/ These components are 2W resistors that only see 1/2W at max. during normal use. I have contacted IRC still wqaiting for a response. The resistors were tested as good. But the circuit
Electronics Forum | Wed Jul 26 15:28:11 EDT 2006 | RLM
How does the machine sense that the fan is working/not working? The fan may be operational but the sense mechanism may be at fault.
Used SMT Equipment | Pick and Place/Feeders
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Used SMT Equipment | In-Circuit Testers
Agilent N4011A MIMO/Multi-port Adapter Agilent-HP N4011A MIMO/Multi-port Adapter The N4011A MIMO/Multi-port Adapter is a 1/4 rack-width unit, used in conjunction with a N4010A test set to provide additional features to support production test
Industry News | 2012-11-02 09:04:14.0
IPC and SMTA jointly announce the agenda for Session 5 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2017-09-18 14:36:13.0
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium held at the Archie K. Davis Conference Center in Research Triangle Park, NC from November 28 - November 30, 2017.
Parts & Supplies | Pick and Place/Feeders
Advantages of JUKI electric feeder With the electronic parts more sophisticated, more and more small, the use of electric feeder has become the standard placement of the placement machine, the old placement machine can use electric feeder has becom
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Apr 14 00:00:00 EDT 2020 - Tue Apr 14 00:00:00 EDT 2020 | ,
Why Are We Cleaning No-Clean?
Events Calendar | Tue Apr 07 00:00:00 EDT 2020 - Tue Apr 07 00:00:00 EDT 2020 | ,
Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | South Plainfield, New Jersey USA | Research and Development
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMTnet Express, January 8, 2020, Subscribers: 33,435, Companies: 10,958, Users: 25,498 Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms Credits: Polymer Competence Center Leoben GmbH PCBs have a wide
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/technical-papers
if SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests This paper details the investigation of brittle solder joint failure mechanisms during high-speed solder ball shear and pull testing
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. There are three major mechanisms of solder joint failure, although these often interplay with each other simultaneously. These are: 1) tensile rupture or fracture due to mechanical overloading
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