STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b
Electronics Forum | Fri Mar 23 14:43:19 EDT 2018 | dleeper
What sort of components are missing? One possibility is moisture sensitive parts outgassing during reflow. The jets of steam propel the parts off the PCBA. Another thing to look at is your convection oven fan speeds. On some ovens this is adjustabl
Electronics Forum | Sun Mar 25 08:45:00 EDT 2018 | jacobidiego
Normally some random components of size 0604 or below and may be due to a thermal mass being close like a transformer or AC electrolytic caps. We tried changing fan speed, but this will change the thermal profile and avoid the thermal mass from bein
Used SMT Equipment | Conveyors
Like New, only used for 2 months. Incline to Decline, edge belt wave unloading system with top side cooling fans. Left to right process flow, variable belt speed. Hand crank for width adjustment out to 20 inches. Completely cleaned and tested, ne
Used SMT Equipment | Coating and Encapsulation
Reflow oven by Technoprint in good condition. Technoprint Mistral 260 Product information: Forced air convection reflow oven heat to maximum temperatures of up to 300°C. Forced air convection provides uniform heating and prevents shadowing. Th
Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
Industry News | 2017-08-29 15:41:30.0
The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.
Parts & Supplies | Pick and Place/Feeders
CABLE:EXTENSION FAN IN/OUT-SIDE
Parts & Supplies | Assembly Accessories
JUKI-S-HOUSING-ASM 40001137 Wait Sensor ASM L828E8210A0 SYNQNET CABLE 120 ASM 40003262 SYRINGE SV CBL ASM 40073432 XL P-S LINEAR SENS CABLE ASM 40024259 X AXIS LMT CABLE ASM 40002066 BU PIN EMITTE
Technical Library | 2021-06-21 19:34:02.0
In this era of electronics miniaturization, high yield and low-cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. In order to maximize substrate real-estate, the distance between Cu traces also known as line and space (L/S) should be minimized. Typical PCB technology consists of L/S larger than 40 µ whereas more advanced wafer level technology currently sits at or around 2 µm L/S. In the past decade, the chip size has decreased significantly along with the L/S on the substrate. The decreasing chip scales and smaller L/S distances has created unique challenges for both printed circuit board (PCB) industry and the semiconductor industry. Fan-out panel-level packaging (FOPLP) is a new manufacturing technology that seeks to bring the PCB world and IC/semiconductor world even closer. While FOPLP is still an emerging technology, the amount of high-volume production in this market space provide a financial incentive to develop innovative solutions in order to enable its ramp up. The most important performance aspect of the fine line plating in this market space is plating uniformity or planarity. Plating uniformity, trace/via top planarity, which measures how flat the top of the traces and vias are a few major features. This is especially important in multilayer processing, as nonuniformity on a lower layer can be transferred to successive layers, disrupting the device design with catastrophic consequences such as short circuits. Additionally, a non-planar surface could also result in signal transmission loss by distortion of the connecting points, like vias and traces. Therefore, plating solutions that provide a uniform, planar profile without any special post treatment are quite desirable.
Technical Library | 2019-12-12 02:43:44.0
Today we discuss the reason that causes temperature humidity chamber to alarm,In most cases, the equipment alarm is caused by the improper operation in the process of use, which mainly includes following reasons:that are refrigeration system, temperature system and circulating system. First, Refrigeration system 1, refrigeration compressor overpressure alarm. If the refrigerant pressure exceeds the set value, it will stop and alarm at the same time. At this time, the fault must be eliminated and then manually reset. 2, short phase power supply, phase sequence alarm. When the external power supply of the equipment is out of phase or the phase sequence is changed, it will stop and alarm at the same time. 3. The circulating cooling water is short of water to alarm. When the water pressure of the cooling circulating water system is insufficient, it will stop and alarm at the same time, and it must wait for the fault to be eliminated and reset at the same time before it could run normally. 4, refrigeration compressor overheating alarm. When the coil of the compressor is overheated and the power supply of the line is not normal, it will stop and alarm at the same time. Second, Temperature system 1, the overtemperature alarm in the chamber. The sensors in the channel and the sample area are equipped with overtemperature protection devices, and there are also overtemperature protecter on the control panel. When the temperature in the working chamber exceeds the setting value on the controller, it will stop and alarm. 2. sample overtemperature protection. When the temperature in the sample area exceeds the protection temperature set by the controller, it will stop and alarm at the same time. The overtemperature protection of the sample is divided into upper limit protection and lower limit protection, which can be set according to the demand, Third,Circulating system 1. The alarm is caused by the overheating of the circulating fan. When the coil of the fan is over-heated, the alarm will be stopped at the same time. 2. The fan over-current alarm. When the current of the fan exceeds the allowable value, the alarm is stopped at the same time, and the normal operation can only be carried out after the fault maintenance of the overcurrent is completed. This is what we talk about today,if you have more questions,let us know.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
A demo of the Shuttle Star SV560 A BGA Rework Station.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Career Center | singapore, Singapore | Accounting/Finance,Engineering,Purchasing,Quality Control
Requirements: Degree in Mechanical Engineering in both design and construction ( Min 4-5 years of Relvant working experience) Have a good knowledge in rotating equipment such as pumps, compressors, turbines, fans, blowers etc. Familar with the requ
Career Center | Phoenix, Arizona USA | Management,Sales/Marketing
Position Overview: Are you interested in Selling as a career? Are you motivated by money? Are you interested in an Outside Sales position where by using our proven sales tools and methodologies, under the direction of a Sales Mentor, you can achiev
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-fanout-for-bga_topic1888.xml
. Via Fanout For BGA : Add option to add fan out for... Author: mahmoodv99Subject: 1888Posted: 10 May 2016 at 10:38pmAdd option to add fan out for BGA in footprint itself with options via size, trace size, etc.
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2772.html
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