Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2017-05-15 16:35:00.0
SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2019-03-03 18:51:58.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.
Industry News | 2010-09-07 11:18:39.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with the SMTA China 5th Anniversary Keynote Breakfast Reception, which took place September 1, 2010 at the Futian Shangri-la, Shenzhen Hotel.
Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2023-10-23 09:44:34.0
Changes address advances in rigid printed board fabrication processes
