Industry Directory | Consultant / Service Provider
College students will work as team to complete their final year project. I think this is a good idea. Currently, they have to choose best project center for their final semester. Elysium Pro will be good for all students career.
Industry Directory | Manufacturer's Representative
SSI designs and manufacture's flexible automation soluitons for PCB testing processes, final electronic assembly, marking/labeling, and final product packaging.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
In the integrated circuit, the circuit with storage function without physical form is also known as memory, such as RAM, FIFO, etc.; In the system, the storage device with physical form is also called memory, such as memory stick, TF card, etc. All t
Electronics Forum | Wed Jul 02 06:56:34 EDT 2003 | davef
There's nothing wrong doing about adding a dessicant. You'll need to: * Seal the bag. [you may end-up needing a moisture barrier bag] * Select a dessicant packaging that is ESD dissipative.
Electronics Forum | Mon Jun 30 22:02:43 EDT 2003 | davef
If you don't seal your packaging, the silica gel will try to remove the moisture from the air and will become saturated pretty quickly. There is no requirement that you pack/ship with dessicants. Some customers require such things though. Why do y
Used SMT Equipment | AOI / Automated Optical Inspection
Capture on the fly technology 3D Fusion Lighting (RGB+White LED's) 5 megapixel color imaging 2 top-down and 4 side angle cameras Quick set-up High speed, high defect coverage Low false failure rate Programmable conveyor for boards up to 20 x 2
Used SMT Equipment | Board Cleaners
Details: • Enhanced chemical package • Wash dual Hurricane Jets w/15hp upgrade • Rinse dual Hurricane jets • Flowmeter Prewash and final rinse (digital) • Torrid Zone Dryer • Interior lighting •
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-02-10 08:20:11.0
Leading Suppliers of Chemistries for Circuit Board Processing Have Entered a Selling and Services Deal
Parts & Supplies | Pick and Place/Feeders
BNC-FINAL RESISTOR 50 OHM
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Parts & Supplies | Pick and Place/Feeders
00349541-01 CLAMPING CARTRIDGE UNIT KP-12-600 00349542-01 VALVE MYH-3-0,9 LED 00349556S01 COMPRESSION SPRING 0,63x3,2x22,5 00349568S03 COMP.-VISION II SIPLACE 80F4. 00349584-03 COMP.MAGAZINE LONG LED 00349592-01 COMP.Magazine long W14,1 H1,7 LE1
Technical Library | 2023-01-17 17:35:07.0
After years of concentration on resolving productivity- related concerns such as increasing speed, consistency and throughput while reducing costs, many of the world's leading electronics manufacturers have added a new mandate to their agendas. They are seeking to minimize the environmental impacts of their assembly processes and final products without sacrificing the high levels of productivity and quality that have been achieved through decades of effort.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Events Calendar | Tue Dec 11 00:00:00 EST 2018 - Tue Dec 11 00:00:00 EST 2018 | ,
Inspecting PWB Assemblies for Defects
Events Calendar | Thu Apr 16 00:00:00 EDT 2020 - Fri Apr 17 00:00:00 EDT 2020 | ,
Smart Fabrics Virtual Summit 2020
Career Center | Appleton, Wisconsin USA | Production,Quality Control,Technical Support
Due to our continued growth Surface Mount Technology Corp has several open positions on across each shift. Come be a part of TeamSMT. 1st Shift Openings Prep Post Wave Inspection Final (Previous Experience Required) Rework (Previous Experienc
Career Center | Westbury, New York USA | Management,Production
Job Location: Long Island, NY. Salary: $50K � $65K plus bonus Company: A fast growing, high-volume electronics manufacturer. Description: Are you looking for an opportunity to work in a fast-paced manufacturing environment? Have you supervise
Career Center | vapi,gujrat, India | Engineering
analog and digital electronics circuit,VLSI,microprocessor and microcontroller,semiconductor,wireless communication.
Career Center | Xiamen, China | Sales/Marketing
I can source, procure and conduct quality control on the products manufactured in China. I can help to source factories, consolidate and ship samples, conduct QC on the manufactured product and arrange shipping for final products. My working exprie
ORION Industries | http://orionindustries.com/pdfs/osj/Orion%20OSJ%202016%20-%20Fall.pdf
Microsoft Word - OSJ 2016-FINAL *Small Business * ISO9001:2008 * AS9100 * CCR Registered * ITAR Registered #M18334 *Waterjet Cutting * Laser Cutting * High Speed Die Cutting
Heller Industries Inc. | https://hellerindustries.com/parts/682873/
682873 - SUPPORT PLATE CBS ENTRANCE FINAL ASSY Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
