Electronics Forum: fine pitch flip chip (Page 1 of 21)

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

Re: Flip chip placer

Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley

| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere

Fine pitch & PCB finish

Electronics Forum | Tue Feb 22 10:44:12 EST 2005 | Dougs

when you talk about stencil design, what would you recommend for aperture size on fine pitch if the customer insists on hasl finish on fine pitch devices? i usually use a 10% reduction on everything we have been using ( 16mil pitch and upwards and 0

SMT chip processing short-circuit bad phenomenon

Electronics Forum | Thu Oct 27 06:36:33 EDT 2022 | richardcargill

The PCB needs to have a flat finish to the pads too - HASL finished boards don't work well with fine pitched ICs/QFNs etc

SMT chip processing short-circuit bad phenomenon

Electronics Forum | Thu Oct 27 06:05:50 EDT 2022 | angela t

SMT chip processing short-circuit bad phenomenon mostly in the fine pitch IC pins, mostly in the 0.5mm and the following pitch between the IC pins, because its spacing is small, improperly designed template or printing a slight omission is very easy

PCB for fine-pitch flip-chip

Electronics Forum | Wed Apr 18 16:13:43 EDT 2012 | tomzee

Hello All. First time poster. I need to design a PCB which will include a Bumped-die type chip with 6mil (152.4 um) pad pitch. I read somewhere that FR4 type board may not be a good choice for such small footprint. I have not had to deal with board

PC Assembly of 0.5mm pitch array Chip Scale Package with HASL fi

Electronics Forum | Thu Dec 18 15:48:25 EST 2003 | Subhash Nariani

Hello, Does anyone have experience with the PCB assembly of 0.5mm pitch chip scale packages with HASL finish? Characterization data that you can share? Tribal knowledge has it that the height variations of the solder prevent the use of HASL for fin

Help with new placement equipment

Electronics Forum | Wed Oct 14 19:32:14 EDT 1998 | John Godfrey

I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch, B

Re: Help with new placement equipment

Electronics Forum | Mon Oct 19 16:17:00 EDT 1998 | Curt Goldman

| I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch,

Re: BGA vs. QFP Packaging.

Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F

Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl

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