Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk
We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.
| https://pcbasupplies.com/cross-reference/
Thermaltronics cross matches with Metcal and Hakko Toggle menu Call Us! 469-200-1289 Login or Sign Up 0 Search × Search × Main Menu Shipping
Lewis & Clark | http://www.lewis-clark.com/shop/page/19/
preventative maintenance procedures* PACKAGING FOR SHIPMENT: All feeders are professionally packaged for safe transport and tracking information is provided to you. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 … 17 18 19 20 21 … 22 23 24 25 26 27 28 Ready To Buy