Industry News: flaking wet solder paste (Page 1 of 37)

Revive Your Dispenser with Advanced Dispense Technologies

Industry News | 2016-12-09 23:33:42.0

GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.

GPD Global

GPD Global to Roll Out FPC Dispense Platform at Productronica

Industry News | 2013-10-09 10:29:04.0

GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.

GPD Global

Integrate Advanced Precision Auger Pump for Dispensing Small Volumes down to 01005

Industry News | 2016-08-25 17:56:34.0

GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.

GPD Global

Session 5 Agenda Announced for IPC/SMTA High-Performance Cleaning and Coating Conference

Industry News | 2010-10-18 14:10:04.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 5 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Association Connecting Electronics Industries (IPC)

SMTA International Tackles Head-in-Pillow Defects

Industry News | 2011-08-17 12:59:10.0

The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

What is the working principle of I.C.T Lyra Reflow Oven

Industry News | 2022-11-11 07:33:41.0

Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.

Dongguan Intercontinental Technology Co., Ltd.

The SMTA Capital Chapter to Host First Meeting of the Year on March 4th at Johns Hopkins Applied Physics Lab

Industry News | 2014-01-29 10:18:33.0

The SMTA Capital Chapter is pleased to announce its first meeting of 2014 on March 4th, from 5:30 pm until 8 pm at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter March Meeting to Feature Nanosolder Expert

Industry News | 2014-02-19 16:47:48.0

The SMTA Capital Chapter is pleased to announce its first meeting of 2014 on March 4th, from 5:30 pm until 8 pm at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723.

Surface Mount Technology Association (SMTA)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

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