Industry Directory: flex and bga (24)

PRO INNOVATIVE TECHNOLOGIES PVT LTD

Industry Directory | Manufacturer / Other

Established 1991 PITPL undertakes turnkey manufacture of PCB assemblies ,box builds,LED lamps for both prototype/ mass production.Capabilities include assembling 0201,microBGA,UCSP,flex pcbs.we are ISO9001/TS16949 qualified.

NTC Manufacturing

Industry Directory | Manufacturer

We are electronic manufacturing company that specializes in 24-48hr. Turn around as well as critical or complex rework.

New SMT Equipment: flex and bga (86)

PCB Rework and Repair Training

New Equipment | Education/Training

This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more.  Students will be introduced to the proper techniques for SMT & PTH compon

Precision PCB Services, Inc

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

Electronics Forum: flex and bga (417)

Re: Conductive Adhesives and Underfill used on flex ckt

Electronics Forum | Tue Jan 12 15:04:40 EST 1999 | Earl Moon

| I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chi

6 layer board and routing bga package

Electronics Forum | Fri Feb 19 05:08:40 EST 2016 | truewanderer

Thank you Tsvetan Usunov

Used SMT Equipment: flex and bga (28)

Yamaha Refurbished YV180XG Pick and Place Machine

Yamaha Refurbished YV180XG Pick and Place Machine

Used SMT Equipment | Chipshooters / Chip Mounters

Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha YV100X Pick and Place machine

Yamaha YV100X Pick and Place machine

Used SMT Equipment | Chipshooters / Chip Mounters

Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X  substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: flex and bga (312)

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

PCB Engineering and Lenthor Engineering Merge

Industry News | 2003-02-19 09:34:32.0

Joined Forces to Continue Support of the Interconnect Market

SMTnet

Parts & Supplies: flex and bga (119)

Juki 2080 laser 8005674 and repair

Juki 2080 laser 8005674 and repair

Parts & Supplies | Pick and Place/Feeders

Supply JUKI 2080 laser 8005674 and repair Other juki parts: 40045126 HEAD L UP/DOWN SENSOR ASM 40045127 HEAD R UP/DOWN SENSOR ASM 40045132 HEAD L EJECTOR ASM 40045133 HEAD R EJECTOR ASM 40045135 FAN MOTOR(X MOTOR) ASM 40045136 LASER SENSOR CON

ZK Electronic Technology Co., Limited

Universal Instruments GSM Nozzles available for flexhead and flexjet

Universal Instruments GSM Nozzles available for flexhead and flexjet

Parts & Supplies | Pick and Place/Feeders

Universal GSM Nozzles available for flexhead and flexjet Universal GSM FlexHead Nozzles Part Number Product Description 45466933 120F Molded Nozzle 45466916 125F Compliant Tip Nozzle 45466921 160F Compliant Tip Nozzle 45466931 234F Molded

ZK Electronic Technology Co., Limited

Technical Library: flex and bga (27)

Underfill Materials Dispensing in Electronics Manufacturing Applications

Technical Library | 2024-08-20 00:40:08.0

In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.

GPD Global

Hidden Head-In-Pillow soldering failures

Technical Library | 2022-12-23 20:44:54.0

One of the upcoming reliability issues which is related to the lead-free solder introduction, are the headin-pillow solderability problems, mainly for BGA packages. These problems are due to excessive package warpage at reflow temperature. Both convex and concave warpage at reflow temperature can lead to the head-in-pillow problem where the solder paste and solder ball are in mechanical contact but not forming one uniform joint. With the thermo-Moiré profile measurements, this paper explains for two flex BGA packages the head-in-pillow. Both local and global height differences higher than 100 µm have been measured at solder reflow temperature. This can be sufficient to have no contact between the molten solder ball and solder paste. Finally, the impact of package drying is measured

IMEC

Videos: flex and bga (368)

printed circuit board conveyor,PCB conveyor,1000mm PCB conveyor

printed circuit board conveyor,PCB conveyor,1000mm PCB conveyor

Videos

https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava

ASCEN Technology

SMT conveyor,PCB linking conveyor,PCB conveyor

SMT conveyor,PCB linking conveyor,PCB conveyor

Videos

https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/100.html PCB linking conveyor and PCB belt conveyor mainly used to connect different type PCB board handing equipment effectively for the SMT production line. ASCEN technology is ava

ASCEN Technology

Training Courses: flex and bga (5)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: flex and bga (8)

SMTA International 2020 Conference & Exhibition

Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA

SMTA International 2020 Conference & Exhibition

Surface Mount Technology Association (SMTA)

DFM Panel Discussion for PCB Design, Fabrication, and Assembly

Events Calendar | Thu Sep 17 00:00:00 EDT 2020 - Thu Sep 17 00:00:00 EDT 2020 | ,

DFM Panel Discussion for PCB Design, Fabrication, and Assembly

Surface Mount Technology Association (SMTA)

Career Center - Jobs: flex and bga (2)

Process Engineer and Technician

Career Center | , | 2001-05-16 15:58:28.0

Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning

Process and Product Support Engineers

Career Center | , New Jersey USA | Engineering

Several opportunities for skilled SMT Engineers and Product Support Engineers. Skilled in lean manufacturing and Kaizen. Skilled in working with BGA, Flip Chip and other related technologies. Skilled in new product introduction and line support acti

Circuit Search

Career Center - Resumes: flex and bga (7)

SMT process and equipment engineer

Career Center | BANGALORE, India | Engineering,Maintenance,Production

Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance

qa inspector

Career Center | , California | Quality Control

Tammy T Vo P.O. Box 2213 (714) 254-5073  E-mail: nhutamvo@yahoo.com Position of Interest  Senior Quality Inspector Aerospace Manufacturing. / Electronic PCBA/Advanced coating technologies Profile of Qualifications  12 years of experience wo

Express Newsletter: flex and bga (556)

SMTnet Express - October 6, 2016

SMTnet Express, October 6, 2016, Subscribers: 26,499, Companies: 14,980, Users: 41,213 Figure 1-An IoT PCB Using Rigid-Flex Construction PCB Laser Depanelizing Using a UV Laser Bob Wettermann; BEST Inc. One of the methods gaining in popularity

Partner Websites: flex and bga (6319)

ezLOAD Flex

| https://pcbasupplies.com/ezload-flex/

ezLOAD Flex Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick


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SMT feeders

Training online, at your facility, or at one of our worldwide training centers"
Win Source Online Electronic parts

World's Best Reflow Oven Customizable for Unique Applications
PCB Handling Machine with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
SMT Machines

High Throughput Reflow Oven
PCB separator

"回流焊炉"