GPD Global | https://www.gpd-global.com/co_website/pcdpumpseries-underfill.php
Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/pcdpumpseries-underfill.php
Dispense on Flip Chip & BGA, Bumped Silicone Die: Underfill Dispensing Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
-73. 2. N.C. Lee, Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies, Elsevier Science, Great Britain, 2001. 3. W. O’Hara and N. Lee, “Voiding Mechanism in BGA Assembly”, SMI Conference Proceedings, 1995. 4. R
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
-73. 2. N.C. Lee, Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies, Elsevier Science, Great Britain, 2001. 3. W. O’Hara and N. Lee, “Voiding Mechanism in BGA Assembly”, SMI Conference Proceedings, 1995. 4. R
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Plastic ICs/PEMs Flex Circuit Smart Card Bonded Wafers Chip Scale Package Flip Chip Hybrid Ceramic Solar Cells Packaging, Seals Materials Other Plastic ICs/PEMs
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_smt_pcb_semiconductor_rework_conceptronics.html
0.001 inches Handles both grid array and leaded type components. (BGA, CGA, QFP, LCC, TSOP, FLIP-Chip and many others.....) Able to repair board with up to a
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_test_xray_yestech.html
YesTech YesTech YTX 3000 Xray Machine Model Number: HXR-3000 Serial Number: X30604395 Year 2006 Type: High Resolution Xray Inspection System High Perfromance - Manitenance Free - Cost Effective * BGA / Flip Chip
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
. Microelectronics - Bonded Wafer Microelectronics - Chip Capacitor Microelectronics - Chip Scale Package Microelectronics - Flip Chip Microelectronics - Hybrid/MCM/SIP Microelectronics - IGBT Power
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_cr_technology_crx2000_xray.html
CR Technology CRX 2000 CR Technology CRX2000 Xray Equipment Description CR Technology Model Number: CRX2000 Serial Number: 1S1878.0100 Year 2000-2001 Hamamatsu Tube Type -130kV X-Y-Z indexing table with joystick control 18" x 24" X-Y travel Full 360 degrees rotation and tilt up to 90 degrees BGA / Flip Chip Solder joint quality
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