Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2022-10-13 07:44:15.0
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Industry News | 2022-01-29 13:28:14.0
Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.
Industry News | 2014-08-25 21:13:55.0
The Balver Zinn Group announces that Han Raetsen, Area Sales & Support Manager, will present at the IPC Standard and Electronic Manufacturing workshop and seminar. Raetsen will present, "Mixed Technology: The impact of using a SnPb soldering material in combination with Pb-free components", and "Reliability of Fluxes in Selective Soldering Applications."
Industry News | 2013-01-18 16:47:20.0
AIM Solder announces that its VP of Technology Karl Seelig will present his paper titled “Conformal Coating Over No-Clean Flux” at the upcoming IPC APEX Expo
Industry News | 2015-09-29 22:17:04.0
Indium Corporation's Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2016-04-22 14:45:12.0
Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.
