| https://www.eptac.com/webinars/flux-classification-part-2-selecting-the-right-flux-for-your-application/
: The Purpose of Flux Impact of Flux Residue Selection and Qualification Process Flux Performance Specifications Have a question about training or IPC certification
| https://www.eptac.com/webinars/flux-classification-part-2-selecting-the-right-flux-for-your-application
. This Webinar will provide you with a brief insight into: The Purpose of Flux Impact of Flux Residue Selection and Qualification Process Flux Performance Specifications
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-38-clean-vs-no-clean-fluxes
. The flux hardens and can be left on. The problem most people find with it is that it has a dark residue and when we used to use it on Printed circuit boards, the test folks would get upset because it would foul up their test fixtures and test pins
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/drop-jet-fluxing
. The continuous deposition is perfect for fluxing headers, connector pins or other multi-pin through-hole components. The SWAK-OS 4.0 software integrated with the FluxJet Precision Drop-Jet Flux
| https://www.eptac.com/soldertip/soldertip-38-clean-vs-no-clean-fluxes/
don’t have to clean an RMA Flux. The flux hardens and can be left on. The problem most people find with it is that it has a dark residue and when we used to use it on Printed circuit boards, the test folks would get upset because it would foul up their test fixtures and test pins
| https://www.eptac.com/soldertips/gold-removal-issues-with-hollow-cup-connectors/
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/webinar/faqs-clarification-and-interpretation-of-a-variety-of-ipc-standards/
. Definition of burnt flux residue, class defects and its’ implications. Foreign Object Debris (FOD) in and on PC boards. Course Length: 35 Minutes Cost: FREE Presenter(s): Leo Lambert Download PDF Presentation Watch On Demand More Webinars Flux Classification
