Industry Directory | Manufacturer
A manufacturer of pressure-sensitive adhesive tapes and films.
Industry Directory | Manufacturer
Electronic shielding manufacturer, specializing fabric-over-foam profile gaskets, shielding tapes, fabric-over-foam I/O gaskets, cable shielding, shielding laminates, board-level shielding and selectively coated, thermoformed shields.
Orion provides flexible, polyurethane filter foam to remove dust and contaminating particles from the air, gases and liquids in a variety of applications. The open pore skeletal structure provides low air resistance ideal for use in computers, electr
Orion has high-speed die cutting presses ranging from 1 to 60 tons. We also have stamping presses that range from 1 to 60 tons. Our other Die cutting capabilities include: Production parts up to 60" x 30" Kiss cut parts up to 24" x 30"
Electronics Forum | Wed Sep 21 09:22:45 EDT 2011 | patrickbruneel
Russ, Try to shake the 1 gallon jug and see if you can create foam on top of the liquid. If you don’t see any foam at all something is wrong with the flux. Patrick
Electronics Forum | Wed Sep 21 12:03:54 EDT 2011 | russw
If I shake it hard, I get a thin foam which quickly goes away. Not sure what it should look like.
Used SMT Equipment | Soldering - Wave
Fluxer: Yes, foam Preheat: Yes Solder type used last in this machine: Lead Inclusions: Solder pot Cart Condition: Complete and Operational, Where Is. Location: USA Availability: Immediate
Used SMT Equipment | Soldering - Wave
Vintage: 2000 Leaded / Spray and Foam fluxers / Top and Bottom preheaters / Board width 18" / Fingers Less than 1000 hours / 208V-3PHZ-60HZ Complete & Operational USA / FOB Immediate for purchase / 2-4 weeks for shipping
Industry News | 2003-04-25 08:11:22.0
Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.
Industry News | 2014-03-25 09:35:06.0
Count On Tools Inc. (COT)announces the release of the new support plates for its line of ezLOAD Board Supports.
Parts & Supplies | Pick and Place/Feeders
Foam rubber profile 1566 L=140
Technical Library | 2008-12-11 01:15:56.0
Flame retardants have been around since the Egyptians and Romans used alum to reduce the flammability of wood. Brominated flame retardants (BFRs) first experienced use after World War II as the substitution of wood and metal for plastics and foams resulted in materials that were much more flammable. The widespread use of BFRs initiated in the 1970s with the explosion of electronics and electrical equipment and housings. For the US market, all of these products must conform to the UL 94 flammability testing specifications. In fact, the most common printed circuit board (PCB) in the electronics industry, FR-4, is defined by its structure (glass fiber in an epoxy matrix) and its compliance to UL 94 V0 standard.
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
This video is on the repair of damaged corners presented by the professional instructing staff at BEST Inc. Corners get damaged from improper handling, storage or packaging. The repair of these damaged corners for multiple angles including both abov
Long Foam Cutting Tools EPS Milling Router Bits Ballnose Flat End and Conical These big long series foam end mill, ball nose and conical router bits are widely used with robot milling machine and huge CNC router which used to cut molds from EPS foa
Events Calendar | Thu Aug 27 00:00:00 EDT 2020 - Fri Aug 28 00:00:00 EDT 2020 | ,
Foaming in Your Cleaning Process?
Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA
Adhesives & Bonding Expo
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
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pure resin, thermosetting polyimide pure resin 2. Polyimide PI molding methods include: high temperature curing, compression molding, dipping, spraying, calendering, injection molding, extrusion, die-casting, coating Laminating, casting, lamination, foaming, transfer molding, compression molding
