Industry News: gage r (Page 1 of 2)

VEXOS Selects MIRTEC as 3D AOI 'Partner of Choice'

Industry News | 2021-01-17 17:28:43.0

MIRTEC is pleased to announce that VEXOS has selected MIRTEC as their 3D AOI 'Partner of Choice' based on key performance indicators including Inspection Performance, Gage R$&R, Ease of Programming and Customer Support.

MIRTEC Corp

IPC Releases IPC-9850A, Surface Mount Placement Characterization

Industry News | 2012-01-07 21:49:07.0

As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.

Association Connecting Electronics Industries (IPC)

ASC International to Highlight SPI and AOI Systems at SMTA International

Industry News | 2012-09-12 16:47:50.0

ASC International, announces that it will highlight the VisionPro AP450 SPI system and the AV862 AOI system

ASC International

CyberOptics to Exhibit SE 300 Ultra� 3-D Solder Paste Inspection at SMT International 2007

Industry News | 2007-10-04 17:06:26.0

MINNEAPOLIS � September 24, 2007 � CyberOptics Corporation (Nasdaq: CYBE) announced that it will display SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 6 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.

CyberOptics Corporation

CyberOptics to Display SE 300 Ultra� 3-D Solder Paste Inspection at Productronica 2007

Industry News | 2007-11-01 02:12:55.0

MINNEAPOLIS - October 31, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will feature SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth A4.262 with GPS Technologies at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2008

Industry News | 2008-03-14 19:37:03.0

MINNEAPOLIS - March 2008 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2215 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008

Industry News | 2008-04-07 21:53:22.0

MINNEAPOLIS - December 20, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in the West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at ExpoElectronica in Moscow.

Industry News | 2008-04-08 23:15:05.0

MINNEAPOLIS - April 2008 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in distributor AssemRus booth number 13 Hall 104 at the upcoming ExpoElectronica exhibition and conference, scheduled to take place April 15-18, 2008 at the Crocus Expo, Moscow.

CyberOptics Corporation

CyberOptics to Exhibit SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2009

Industry News | 2009-03-23 13:24:38.0

MINNEAPOLIS - March 2009 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will showcase SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

CyberOptics Corporation

Vi TECHNOLOGY®'s component inspection solutions to reduce defective PCBAs @ Nepcon Shenzhen 2010

Industry News | 2010-08-09 13:23:20.0

Vi TECHNOLOGY will be represented with its Chinese Agents to exhibit AOI solutions to reduce defective PCBAs at Nepcon South China Shenzhen from August 31st to September 2nd.

Vi TECHNOLOGY

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