ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2017-03-06
New die design for multi-layer fluid coating makes changing die gaps easier, more accurate, and less prone to human error Polymer Processing Systems
46877 | https://www.nordson.com/zh-CN/divisions/asymtek/your-process/applications-corner/improve-productivity-jet-underfill-into-narrow-gaps-fast
ASYMTEK Products | Nordson Electronics Solutions
ORION Industries | http://orionindustries.com/gap-pad.php
. However, problems may still arise when heat sinks are used on irregularly sized components. Gaps between them may allow excessive heat to accumulate This is where Bergquist's Gap Pad VO(tm) shines
ORION Industries | http://orionindustries.com/emi-tapes.php
. When compared to mechanical connectors such as screws, these tapes provide reduced assembly times and solid bond lines with no gaps from which EMI emissions can occur
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_universal_instruments_polaris.html
(OCV)/recogniation (OCR), inspect voids/gaps * Bar Code Readability verification (1D or 2D matrix)., traceability of pallet/piece part
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/news/news/2015-02-25
. Thus, for thin sheet, the lip land is short, which helps to control back-pressure at smaller die gaps, reduces deflection, and lessens the need for draw-down
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/products/powder-coating-booths/lean-cell-fast-color-change-powder-coating-system
Fast Color Change Powder Booth is exceptionally compact, minimizes floor space and conveyor line gaps to maximize your production capacity and color-change speed
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. Offering non-contact jetting systems for underfill dispensing with precision fluid placement. What is Underfill? Underfill is an epoxy material that fills gaps between a chip and its carrier or a finished package and the PCB substrate
40731 | https://www.smta.org/harsh/Harsh-Environments-Program-2019.pdf?v=20052905555
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/harsh/Harsh-Environments-Program-2019.pdf?v=20061608642
Surface Mount Technology Association (SMTA)
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